Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA12 | O43570 | 1/20 | 0.54 |
| ▸ | CA1 | P00915 | 1/20 | 0.54 |
| ▸ | CA2 | P00918 | 1/20 | 0.54 |
| ▸ | CA7 | P43166 | 1/20 | 0.54 |
| ▸ | CA9 | Q16790 | 1/20 | 0.54 |
| ▸ | CA14 | Q9ULX7 | 1/20 | 0.54 |
| ▸ | MAPT | P10636 | 3/20 | 0.47 |
| ▸ | MEN1 | O00255 | 3/20 | 0.47 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.47 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.47 |
| ▸ | THRB | P10828 | 1/20 | 0.47 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.47 |
| ▸ | CYP2A6 | P11509 | 1/20 | 0.47 |
| ▸ | MTNR1A | P48039 | 3/20 | 0.47 |
| ▸ | MTNR1B | P49286 | 3/20 | 0.47 |
| ▸ | NQO1 | P15559 | 1/20 | 0.45 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.44 |
| ▸ | TSHR | P16473 | 1/20 | 0.44 |
| ▸ | GFER | P55789 | 1/20 | 0.44 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30503987 | 0.86 | CA12 (0.52) | CA12CA1CA2CA7CA9 | |
| SCHEMBL4194130 | 0.86 | CA12 (0.52) | CA12CA1CA2CA7CA9 | |
| SCHEMBL10103841 | 0.83 | CA12 (0.40) | CA12CA1CA2CA7CA9 | |
| SCHEMBL9795842 | 0.82 | CYP1A2 (0.48) | MAPTMEN1KMT2AALDH1A1CYP1A2 | |
| SCHEMBL12657996 | 0.82 | ACHE (0.56) | MAPTMEN1KMT2AALDH1A1CYP1A2 | |
| SCHEMBL19382614 | 0.80 | CYP1A2 (0.61) | CA12CA1CA2CA7CA9 | |
| SCHEMBL7129654 | 0.80 | IDO1 (0.54) | CA12CA1CA2CA7CA9 | |
| SCHEMBL29137562 | 0.78 | CYP11B1 (0.54) | CA12CA1CA2CA7CA9 | |
| SCHEMBL10823084 | 0.78 | ALDH1A1 (0.55) | CA12CA1CA2CA7CA9 | |
| SCHEMBL8518991 | 0.78 | CA12 (0.52) | CA12CA1CA2CA7CA9 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2409979-B1 | PROCESS FOR PRODUCTION OF PHOSPHORUS-ATOM-CONTAINING PHENOL, NOVEL PHOSPHORUS-ATOM-CONTAINING PHENOL, CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR SEALING MATERIAL | DAINIPPON INK & CHEMICALS (JP) | 2019-06-26 | — | — | EP | disclosed |
| US-9217053-B2 | Active ester resin, thermosetting resin composition, cured product of same, semiconductor encapsulation material, prepreg, circuit board, and build-up film | DIC CORPORATION (JP) | 2015-12-22 | — | — | US | disclosed |
| US-20150118499-A1 | ACTIVE ESTER RESIN, THERMOSETTING RESIN COMPOSITION, CURED PRODUCT OF SAME, SEMICONDUCTOR ENCAPSULATION MATERIAL, PREPREG, CIRCUIT BOARD, AND BUILD-UP FILM | DIC CORPORATION (JP) | 2015-04-30 | — | — | US | disclosed |
| US-8440781-B2 | Epdxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epdoxy resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2013-05-14 | — | — | US | disclosed |
| US-8440781-B2 | Epdxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epdoxy resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2013-05-14 | — | — | US | disclosed |
| US-8420749-B2 | Epoxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epoxy resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2013-04-16 | — | — | US | disclosed |
| US-8420749-B2 | Epoxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epoxy resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2013-04-16 | — | — | US | disclosed |
| US-8288003-B2 | Method for producing phosphorus-containing phenolic compound, novel phosphorus-containing phenol, curable resin composition, cured product of the same, printed wiring board, and semiconductor sealing material | DIC CORPORATION (JP) | 2012-10-16 | — | — | US | disclosed |
| EP-2185507-B1 | FUNGICIDE N-6-MEMBERED FUSED (HETERO)ARYL-METHYLENE-N-CYCLOALKYL CARBOXAMIDE DERIVATIVES | BAYER CROPSCIENCE AG (DE) | 2012-04-25 | — | — | EP | disclosed |
| US-20120095156-A1 | METHOD FOR PRODUCING PHOSPHORUS-CONTAINING PHENOLIC COMPOUND, NOVEL PHOSPHORUS-CONTAINING PHENOL, CURABLE RESIN COMPOSITION, CURED PRODUCT OF THE SAME, PRINTED WIRING BOARD, AND SEMICONDUCTOR SEALING MATERIAL | DIC CORPORATION (JP) | 2012-04-19 | — | — | US | disclosed |
| US-7985822-B2 | Epoxy resin cured with phenol-formaldehyde resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2011-07-26 | — | — | US | disclosed |
| US-20100087590-A1 | EPOXY RESIN COMPOSITION AND CURED ARTICLE THEREOF, SEMICONDUCTOR ENCAPSULATION MATERIAL, NOVEL PHENOL RESIN, AND NOVEL EPOXY RESIN | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2010-04-08 | — | — | US | disclosed |
| US-20090054585-A1 | EPOXY RESIN COMPOSITION AND CURED ARTICLE THEREOF, SEMICONDUCTOR ENCAPSULATION MATERIAL, NOVEL PHENOL RESIN, AND NOVEL EPOXY RESIN | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2009-02-26 | — | — | US | disclosed |
| US-20080255315-A1 | Epoxy Resin Composition,Cured Article Thereof, Semiconductor Sealing Material, Novel Phenol Resin, Novel Epoxy Resin,Method for Producing Novel Phenol Resin, And Method For Producing Novel Epoxy Resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2008-10-16 | — | — | US | disclosed |
| EP-0737670-B1 | Tricyclic amides, processes for their preparation, and pharmaceutical compositions containing them | ADIR (FR) | 1999-07-21 | — | — | EP | disclosed |
| EP-0737670-A1 | Tricyclic amides, processes for their preparation, and pharmaceutical compositions containing them | ADIR ET COMPAGNIE (FR) | 1996-10-16 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20120095156-A1 | METHOD FOR PRODUCING PHOSPHORUS-CONTAINING PHENOLIC COMPOUND, NOVEL PHOSPHORUS-CONTAINING PHENOL, CURABLE RESIN COMPOSITION, CURED PRODUCT OF THE SAME, PRINTED WIRING BOARD, AND SEMICONDUCTOR SEALING MATERIAL | PPA1, RBBP4, SMARCB1 | CA12 2399/4885CA1 680/4885CA2 703/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.