Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ESR1 | P03372 | 5/20 | 0.41 |
| ▸ | ESR2 | Q92731 | 4/20 | 0.41 |
| ▸ | NR1H2 | P55055 | 3/20 | 0.38 |
| ▸ | NR1H3 | Q13133 | 3/20 | 0.38 |
| ▸ | TYMS | P04818 | 1/20 | 0.37 |
| ▸ | HSP90AA1 | P07900 | 2/20 | 0.36 |
| ▸ | MEN1 | O00255 | 2/20 | 0.36 |
| ▸ | MAPT | P10636 | 2/20 | 0.36 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.36 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.36 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.36 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.36 |
| ▸ | TSHR | P16473 | 1/20 | 0.36 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.36 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.36 |
| ▸ | BLM | P54132 | 1/20 | 0.36 |
| ▸ | PMP22 | Q01453 | 1/20 | 0.36 |
| ▸ | KCNMA1 | Q12791 | 1/20 | 0.36 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.36 |
| ▸ | APP | P05067 | 2/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9891724 | 0.96 | ESR1 (0.43) | ESR1ESR2NR1H2NR1H3TYMS | |
| SCHEMBL13966982 | 0.95 | ESR1 (0.38) | ESR1ESR2NR1H2NR1H3TYMS | |
| SCHEMBL13292495 | 0.92 | BRD4 (0.38) | ESR1ESR2NR1H2NR1H3TYMS | |
| SCHEMBL15593256 | 0.91 | APP (0.39) | ESR1ESR2NR1H2NR1H3TYMS | |
| SCHEMBL25969184 | 0.90 | MEN1 (0.38) | ESR1ESR2NR1H2NR1H3TYMS | |
| SCHEMBL822316 | 0.90 | ESR1 (0.40) | ESR1ESR2NR1H2NR1H3TYMS | |
| SCHEMBL9610064 | 0.88 | TYMS (0.47) | ESR1ESR2NR1H2NR1H3TYMS | |
| SCHEMBL21933189 | 0.87 | PKM (0.38) | ESR1ESR2NR1H2NR1H3TYMS | |
| SCHEMBL12367660 | 0.85 | ESR1 (0.43) | ESR1ESR2NR1H2NR1H3MEN1 | |
| SCHEMBL17898388 | 0.85 | BRD4 (0.47) | ESR1ESR2TYMSMEN1MAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230260787-A1 | COMPOSITION FOR FORMING PROTECTIVE FILM AGAINST ALKALINE AQUEOUS HYDROGEN PEROXIDE, SUBSTRATE FOR PRODUCING SEMICONDUCTOR APPARATUS, METHOD FOR FORMING PROTECTIVE FILM, AND METHOD FOR FORMING PATTERN | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-08-17 | — | — | US | disclosed |
| US-20120135251-A1 | PHOTOSENSITIVE POLYIMIDE HAVING SILICON MODIFIED GROUP, ADHESIVE COMPOSITION AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2012-05-31 | — | — | US | disclosed |
| US-8163071-B2 | Hollow fiber, dope composition for forming hollow fiber, and method of preparing hollow fiber using the same | IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) (KR) | 2012-04-24 | — | — | US | disclosed |
| US-20090297850-A1 | HOLLOW FIBER, DOPE COMPOSITION FOR FORMING HOLLOW FIBER, AND METHOD OF MAKING HOLLOW FIBER USING THE SAME | IUCF-HYU(INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) (KR) | 2009-12-03 | — | — | US | disclosed |
| US-20090286078-A1 | POLYIMIDES DOPE COMPOSITION, PREPARATION METHOD OF HOLLOW FIBER USING THE SAME AND HOLLOW FIBER PREPARED THEREFROM | INDUSTRY-UNIVERSITY COOPERATION FOUNDATION, HANYANG UNIVERSITY (KR) | 2009-11-19 | — | — | US | disclosed |
| US-20090286904-A1 | POLYAMIC ACIDS DOPE COMPOSITION, PREPARATION METHOD OF HOLLOW FIBER USING THE SAME AND HOLLOW FIBER PREPARED THEREFROM | INDUSTRY-UNIVERSITY COOPERATION FOUNDATION, HANYANG UNIVERSITY (KR) | 2009-11-19 | — | — | US | disclosed |
| US-20090282982-A1 | HOLLOW FIBER, DOPE COMPOSITION FOR FORMING HOLLOW FIBER, AND METHOD OF PREPARING HOLLOW FIBER USING THE SAME | IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) (KR) | 2009-11-19 | — | — | US | disclosed |
| US-7485405-B2 | Photo-curable resin composition comprising a polyimide, a process for forming a pattern therewith, and a substrate protecting film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-02-03 | — | — | US | disclosed |
| US-7485405-B2 | Photo-curable resin composition comprising a polyimide, a process for forming a pattern therewith, and a substrate protecting film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-02-03 | — | — | US | disclosed |