Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TYMS | P04818 | 1/20 | 0.47 |
| ▸ | ESR1 | P03372 | 4/20 | 0.39 |
| ▸ | ESR2 | Q92731 | 3/20 | 0.39 |
| ▸ | NR1H3 | Q13133 | 6/20 | 0.39 |
| ▸ | NR1H2 | P55055 | 4/20 | 0.39 |
| ▸ | MEN1 | O00255 | 1/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.38 |
| ▸ | CASP1 | P29466 | 1/20 | 0.38 |
| ▸ | GRM1 | Q13255 | 1/20 | 0.38 |
| ▸ | GRM4 | Q14833 | 1/20 | 0.38 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL23133322 | 0.93 | TYMS (0.43) | TYMSESR1ESR2NR1H3NR1H2 | |
| SCHEMBL2622758 | 0.88 | ESR1 (0.41) | TYMSESR1ESR2NR1H3NR1H2 | |
| SCHEMBL9891724 | 0.84 | ESR1 (0.43) | TYMSESR1ESR2NR1H3NR1H2 | |
| SCHEMBL13966982 | 0.83 | ESR1 (0.38) | TYMSESR1ESR2NR1H3NR1H2 | |
| SCHEMBL27250012 | 0.83 | TYMS (0.44) | TYMSESR1ESR2NR1H3NR1H2 | |
| SCHEMBL13292495 | 0.82 | BRD4 (0.38) | TYMSESR1ESR2NR1H3NR1H2 | |
| SCHEMBL18932803 | 0.82 | MEN1 (0.46) | TYMSMEN1KMT2A | |
| SCHEMBL22853589 | 0.81 | NPC1 (0.40) | TYMSESR1ESR2NR1H3NR1H2 | |
| SCHEMBL25969184 | 0.81 | MEN1 (0.38) | TYMSESR1ESR2NR1H3NR1H2 | |
| SCHEMBL25969146 | 0.81 | ESR1 (0.49) | TYMSESR1ESR2NR1H3NR1H2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20120135251-A1 | PHOTOSENSITIVE POLYIMIDE HAVING SILICON MODIFIED GROUP, ADHESIVE COMPOSITION AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2012-05-31 | — | — | US | disclosed |