SCHEMBL263157

SCHEMBL263157

C=C(C)C(=O)OC(C)OP(=O)(Oc1ccccc1)Oc1ccccc1

nearest known ligand 0.40

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
ELANE P08246 2/20 0.39
SRC P12931 1/20 0.39
ANPEP P15144 1/20 0.38
LAP3 P28838 1/20 0.38
L3MBTL1 Q9Y468 3/20 0.37
NPSR1 Q6W5P4 2/20 0.37
MAPK1 P28482 1/20 0.37
GAA P10253 1/20 0.35
DPP4 P27487 1/20 0.34
BTN3A1 O00481 2/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25194082 0.97 ELANE (0.39) ELANESRCANPEPLAP3L3MBTL1
SCHEMBL1138436 0.87 POLB (0.43) ELANESRCANPEPLAP3L3MBTL1
SCHEMBL985644 0.79 TSHR (0.41)
SCHEMBL21370 0.79 MTNR1A (0.45) ELANENPSR1GAA
Phenyl Dihydrogen Phosphate SCHEMBL28348982 0.77 SRC (0.54) ELANESRCANPEPLAP3L3MBTL1
SCHEMBL6229594 0.77 HPGD (0.41) ELANESRCANPEPLAP3L3MBTL1
Triphenyl Phosphate SCHEMBL28873780 0.76 SRC (0.50) ELANESRCANPEPLAP3L3MBTL1
Methacrylic Acid SCHEMBL25394729 0.76 MTNR1A (0.43) ELANENPSR1GAA
SCHEMBL24549482 0.75 TSHR (0.39) ELANESRCANPEPLAP3L3MBTL1
SCHEMBL24549483 0.75 L3MBTL1 (0.38) ELANEL3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2804243-B1 BINDER RESIN COMPOSITION FOR SECONDARY BATTERY ELECTRODES, SLURRY FOR SECONDARY BATTERY ELECTRODES, ELECTRODE FOR SECONDARY BATTERIES, AND LITHIUM ION SECONDARY BATTERY MITSUBISHI CHEM CORP (JP) 2017-10-25 EP claimed
US-5444123-A Blend of polyphenylene ether, polystyrene, homo or copolymeric phosphorus compound and low molecular weight phosphorus compounds as flameproofing agents; toughness BASF AKTIENGESELLSCHAFT (DE) 1995-08-22 US claimed
US-9187597-B1 Flame-retardant polylactic acid (PLA) by grafting through of phosphorus-containing polymers directly to PLA backbone INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2015-11-17 US disclosed
US-8449100-B2 Inkjet recording method FUJIFILM CORPORATION (JP) 2013-05-28 US disclosed
US-8133943-B2 Polylactic acid/polycarbonate resin composition and molded product using the same CHEIL INDUSTRIES INC. (KR) 2012-03-13 US disclosed
US-7815434-B2 Dental coating kit KURARAY MEDICAL INC. (JP) 2010-10-19 US disclosed
US-20100238246-A1 INKJET RECORDING METHOD FUJIFILM CORPORATION (JP) 2010-09-23 US disclosed
US-20100160499-A1 Polylactic Acid/Polycarbonate Resin Composition and Molded Product Using the Same CHEIL INDUSTRIES INC. (KR) 2010-06-24 US disclosed
EP-2199341-A2 Polylactic acid/polycarbonate resin composition and molded product using the same Cheil Industries Inc. (KR) 2010-06-23 EP disclosed
EP-1550428-B1 DENTAL COATING KIT KURARAY MEDICAL INC (JP) 2009-03-18 EP disclosed
US-7407741-B2 Photothermographic material FUJIFILM CORPORATION (JP) 2008-08-05 US disclosed
US-7279273-B2 Photothermographic material FUJIFILM CORPORATION (JP) 2007-10-09 US disclosed
US-20070082303-A1 Silver salt particle of nitrogen-containing heterocyclic compound and photothermographic material containing the same FUJI PHOTO FILM CO., LTD. 2007-04-12 US disclosed
US-20070072135-A1 Photothermographic material FUJI PHOTO FILM CO., LTD. 2007-03-29 US disclosed
US-20070031766-A1 Photothermographic material FUJI PHOTO FILM CO., LTD. 2007-02-08 US disclosed
US-20060292503-A1 Photothermographic material and image forming method FUJI PHOTO FILM CO., LTD. 2006-12-28 US disclosed
US-20060078510-A1 Dental coating kit KURARAY MEDICAL INC. (JP) 2006-04-13 US disclosed
EP-1550428-A1 DENTAL COATING KIT Kuraray Medical Inc. (JP) 2005-07-06 EP disclosed
US-5444123-A Blend of polyphenylene ether, polystyrene, homo or copolymeric phosphorus compound and low molecular weight phosphorus compounds as flameproofing agents; toughness BASF AKTIENGESELLSCHAFT (DE) 1995-08-22 US disclosed
EP-0530692-A2 Halogen-free flame resistant thermoplastic moulding masses based on polyphenylenether and polystyrene BASF Aktiengesellschaft (DE) 1993-03-10 EP disclosed