SCHEMBL26327447

SCHEMBL26327447

CC1(C)SCc2cccc3cccc1c23

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.39
CYP3A4 P08684 2/20 0.39
RAD52 P43351 1/20 0.38
ALDH1A1 P00352 7/20 0.33
KDM4E B2RXH2 7/20 0.33
HPGD P15428 6/20 0.33
MAPT P10636 6/20 0.33
HSD17B10 Q99714 5/20 0.33
GAA P10253 4/20 0.33
MEN1 O00255 3/20 0.33
KMT2A Q03164 3/20 0.33
APP P05067 2/20 0.33
SNCA P37840 2/20 0.33
TYMS P04818 2/20 0.33
APAF1 O14727 2/20 0.33
NSD2 O96028 1/20 0.33
NPSR1 Q6W5P4 1/20 0.33
L3MBTL1 Q9Y468 1/20 0.33
HTR2A P28223 1/20 0.32
CYP1A2 P05177 2/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21663064 0.79 HTR2A (0.41) TSHRCYP3A4HSD17B10MEN1KMT2A
SCHEMBL17270542 0.69 CYP3A4 (0.39) TSHRCYP3A4RAD52ALDH1A1KDM4E
Methyl Alcohol SCHEMBL14815617 0.69 CYP3A4 (0.39) TSHRCYP3A4RAD52ALDH1A1KDM4E
SCHEMBL28556001 0.69 CYP3A4 (0.35) TSHRCYP3A4RAD52ALDH1A1KDM4E
Ammonia Solution, Strong SCHEMBL10616781 0.68 KDM1A (0.38) TSHRCYP3A4RAD52ALDH1A1KDM4E
SCHEMBL21663225 0.68 PARP1 (0.40) TSHRCYP3A4RAD52ALDH1A1KDM4E
SCHEMBL15320128 0.68 ALDH1A1 (0.41) TSHRCYP3A4RAD52ALDH1A1KDM4E
SCHEMBL14582984 0.68 TSHR (0.50) TSHRCYP3A4ALDH1A1KDM4EHPGD
SCHEMBL5219545 0.68 TSHR (0.50) TSHRCYP3A4ALDH1A1KDM4EHPGD
SCHEMBL21662875 0.67 KDM4E (0.39) TSHRCYP3A4RAD52ALDH1A1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230350294-A1 Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic Component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-11-02 US disclosed
US-20230350294-A1 Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic Component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-11-02 US disclosed
US-11768434-B2 Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-26 US disclosed