SCHEMBL21662875

SCHEMBL21662875

CN1Cc2cccc3cccc(c23)C1(C)C

nearest known ligand 0.39

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 4/20 0.39
MAPT P10636 3/20 0.39
ALDH1A1 P00352 3/20 0.39
GAA P10253 3/20 0.39
HPGD P15428 3/20 0.39
NSD2 O96028 1/20 0.39
APP P05067 1/20 0.39
SNCA P37840 1/20 0.39
HSD17B10 Q99714 1/20 0.39
CYP3A4 P08684 1/20 0.36
TSHR P16473 1/20 0.36
MEN1 O00255 1/20 0.34
MAPK1 P28482 1/20 0.34
KMT2A Q03164 1/20 0.34
RAD52 P43351 1/20 0.32
ALOX12 P18054 1/20 0.32
TYMS P04818 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26705147 0.85
SCHEMBL18559550 0.79 HTR2A (0.39)
SCHEMBL17270542 0.70 CYP3A4 (0.39) KDM4EMAPTALDH1A1GAAHPGD
SCHEMBL8168627 0.70 MAOA (0.46) KDM4EMAPTALDH1A1GAAHPGD
SCHEMBL21663225 0.69 PARP1 (0.40) KDM4EMAPTALDH1A1HPGDHSD17B10
SCHEMBL6747068 0.69 KDM4E (0.50) KDM4EMAPTMEN1MAPK1KMT2A
SCHEMBL23351420 0.68 ALDH1A1 (0.62) KDM4EMAPTALDH1A1GAAHPGD
SCHEMBL14392561 0.67 ALDH1A1 (0.41) KDM4EMAPTALDH1A1GAAHPGD
Methyl Alcohol SCHEMBL14815617 0.67 CYP3A4 (0.39) KDM4EMAPTALDH1A1GAAHPGD
SCHEMBL26327447 0.67 TSHR (0.39) KDM4EMAPTALDH1A1GAAHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230350294-A1 Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic Component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-11-02 US disclosed
US-11768434-B2 Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-26 US disclosed
US-11768434-B2 Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-26 US disclosed
US-20200041903-A1 POLYMER HAVING A STRUCTURE OF POLYAMIDE, POLYAMIDE-IMIDE, OR POLYIMIDE, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, PHOTOSENSITIVE DRY FILM, AND PROTECTIVE FILM FOR ELECTRIC AND ELECTRONIC PARTS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-02-06 US disclosed