SCHEMBL26338964

SCHEMBL26338964

CC(C)CC(C)(C)C(=O)OCCN(C)C

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CHRM1 P11229 5/20 0.46
CHRM2 P08172 4/20 0.46
CHRM3 P20309 4/20 0.46
CHRM4 P08173 3/20 0.46
CHRM5 P08912 2/20 0.46
CHRNB2 P17787 1/20 0.46
CHRNA4 P43681 1/20 0.46
DNM1 Q05193 1/20 0.38
ALDH1A1 P00352 3/20 0.37
MMP8 P22894 1/20 0.37
CA12 O43570 1/20 0.36
CA1 P00915 1/20 0.36
CA2 P00918 1/20 0.36
CA9 Q16790 1/20 0.36
SMN1; SMN2 Q16637 2/20 0.36
PHLPP2 Q6ZVD8 1/20 0.36
POLB P06746 1/20 0.35
BCHE P06276 1/20 0.33
NPSR1 Q6W5P4 1/20 0.33
CYP1A2 P05177 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26418131 0.86 MMP8 (0.35) CHRM1CHRM2CHRM3CHRM4CHRM5
SCHEMBL19902135 0.86 CHRM1 (0.46) CHRM1CHRM2CHRM3CHRM4CHRM5
SCHEMBL19417262 0.83 CHRM1 (0.38) CHRM1CHRM2CHRM3CHRM4CHRM5
SCHEMBL20673132 0.83 CHRM1 (0.43) CHRM1CHRM2CHRM3CHRM4CHRM5
SCHEMBL10124341 0.83 CHRM1 (0.43) CHRM1CHRM2CHRM3CHRM4CHRM5
SCHEMBL16638216 0.81 MMP8 (0.39) MMP8
SCHEMBL25947141 0.81 MMP8 (0.31) CHRM1CHRM2CHRM3CHRM4CHRM5
SCHEMBL26418212 0.80 MMP8 (0.33) CHRM1CHRM2CHRM3CHRM4MMP8
SCHEMBL17903292 0.80 CHRM1 (0.38) CHRM1CHRM2CHRM3CHRM4CHRM5
SCHEMBL116982 0.79 CHRM2 (0.50) CHRM1CHRM2CHRM3CHRM4CHRM5

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230305403-A1 PATTERN FORMING METHOD, MANUFACTURING METHOD OF CIRCUIT BOARD, AND LAMINATE FUJIFILM CORPORATION (JP) 2023-09-28 US disclosed