SCHEMBL26490682

SCHEMBL26490682

CCN(C[C@H](C)O)C(C)=O

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.36
TSHR P16473 1/20 0.35
MMP1 P03956 1/20 0.34
MMP2 P08253 1/20 0.34
MMP3 P08254 1/20 0.34
MMP8 P22894 1/20 0.34
MC4R P32245 1/20 0.34
CHRM2 P08172 2/20 0.33
CHRM4 P08173 2/20 0.33
CHRM5 P08912 2/20 0.33
CHRM1 P11229 2/20 0.33
CHRM3 P20309 2/20 0.33
CA12 O43570 2/20 0.33
CA1 P00915 2/20 0.33
CA9 Q16790 2/20 0.33
HTR1A P08908 1/20 0.33
LIPE Q05469 1/20 0.33
CA2 P00918 1/20 0.33
KDM4E B2RXH2 1/20 0.32
ACR P10323 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10391701 1.00 LMNA (0.36) LMNATSHRMMP1MMP2MMP3
SCHEMBL6061789 0.87 CA12 (0.37) TSHRCHRM2CHRM4CHRM5CHRM1
SCHEMBL5207797 0.83 CA12 (0.50) LMNAMMP1MMP2MMP3MMP8
SCHEMBL26490683 0.82 CA12 (0.41) TSHRCA12CA1CA9CA2
SCHEMBL16858392 0.79 LMNA (0.34) LMNAMMP1MMP2MMP3MMP8
SCHEMBL12811753 0.79 DPP4 (0.35) LMNAMMP1MMP2MMP3MMP8
SCHEMBL10391188 0.79 LMNA (0.34) LMNAMMP1MMP2MMP3MMP8
SCHEMBL1260004 0.79 TSHR (0.31) LMNATSHRMMP1MMP2MMP3
SCHEMBL27823278 0.76 MC4R (0.37) LMNAMMP1MMP2MMP3MMP8
Lactic Acid SCHEMBL28199864 0.76 TP53 (0.52) LMNAMMP1MMP2MMP3MMP8

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230140810-A1 MATERIAL FOR FORMING ADHESIVE FILM, PATTERNING PROCESS, AND METHOD FOR FORMING ADHESIVE FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-05-04 US disclosed
US-20230140810-A1 MATERIAL FOR FORMING ADHESIVE FILM, PATTERNING PROCESS, AND METHOD FOR FORMING ADHESIVE FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-05-04 US disclosed