SCHEMBL26606063

SCHEMBL26606063

Cc1ccccc1NC(=O)Nc1cccc(-c2c(C)cccc2S(=O)(=O)O)c1

nearest known ligand 0.63

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ DDX3X O00571 3/20 0.63
▸ HTT P42858 2/20 0.49
▸ POLB P06746 2/20 0.49
▸ RAB9A P51151 4/20 0.47
▸ NPC1 O15118 3/20 0.47
▸ CA12 O43570 3/20 0.47
▸ CA1 P00915 3/20 0.47
▸ CA2 P00918 3/20 0.47
▸ CA9 Q16790 3/20 0.47
▸ MGLL Q99685 1/20 0.47
▸ CNR1 P21554 1/20 0.46
▸ IMPDH2 P12268 1/20 0.45
▸ MAPT P10636 2/20 0.44
▸ MEN1 O00255 1/20 0.44
▸ KMT2A Q03164 1/20 0.44
▸ GRIK1 P39086 1/20 0.44
▸ GRIK2 Q13002 1/20 0.44
▸ GHSR Q92847 1/20 0.43
▸ KIT P10721 1/20 0.43
▸ KDR P35968 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26606002 0.88 DDX3X (0.63) DDX3XHTTPOLBRAB9ANPC1
SCHEMBL26606111 0.88 CNR1 (0.52) DDX3XHTTRAB9ANPC1CA12
SCHEMBL26606007 0.88 CNR1 (0.51) DDX3XPOLBRAB9ANPC1MGLL
SCHEMBL26606099 0.88 DDX3X (0.55) DDX3XHTTPOLBRAB9ANPC1
SCHEMBL26606081 0.87 NPC1 (0.51) HTTPOLBRAB9ANPC1CA12
SCHEMBL26606008 0.86 DDX3X (0.60) DDX3XHTTPOLBRAB9ANPC1
SCHEMBL26606036 0.83 DDX3X (0.59) DDX3XHTTPOLBRAB9ANPC1
SCHEMBL26606013 0.81 DDX3X (0.53) DDX3XPOLBRAB9ANPC1CA12
SCHEMBL26606101 0.81 DDX3X (0.51) DDX3XHTTPOLBRAB9ANPC1
SCHEMBL26606064 0.81 DDX3X (0.51) DDX3XHTTRAB9ANPC1CA12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4269119-A1 COLOR DEVELOPER, HEAT-SENSITIVE RECORDING MATERIAL, AND COATING MATERIAL FOR HEAT-SENSITIVE RECORDING LAYERS Sanko Co., Ltd. (JP) 2023-11-01 — — EP disclosed
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