SCHEMBL26606008

SCHEMBL26606008

Cc1ccccc1NC(=O)Nc1cccc(-c2cccc(S(=O)(=O)O)c2C)c1

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ DDX3X O00571 3/20 0.60
▸ CNR1 P21554 1/20 0.53
▸ RAB9A P51151 4/20 0.46
▸ NPC1 O15118 3/20 0.46
▸ MGLL Q99685 1/20 0.45
▸ HTT P42858 2/20 0.44
▸ POLB P06746 1/20 0.44
▸ KDR P35968 2/20 0.44
▸ IDH1 O75874 1/20 0.43
▸ IMPDH2 P12268 1/20 0.43
▸ CA12 O43570 1/20 0.43
▸ CA1 P00915 1/20 0.43
▸ CA2 P00918 1/20 0.43
▸ CA9 Q16790 1/20 0.43
▸ MAPT P10636 2/20 0.43
▸ MEN1 O00255 1/20 0.43
▸ KMT2A Q03164 1/20 0.43
▸ IDH2 P48735 1/20 0.42
▸ GRIK1 P39086 1/20 0.42
▸ GRIK2 Q13002 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26606002 0.93 DDX3X (0.63) DDX3XCNR1RAB9ANPC1MGLL
SCHEMBL26606092 0.89 CNR1 (0.55) CNR1RAB9ANPC1MGLLHTT
SCHEMBL26606000 0.88 KDR (0.56) DDX3XRAB9ANPC1HTTKDR
SCHEMBL26606063 0.86 DDX3X (0.63) DDX3XCNR1RAB9ANPC1MGLL
SCHEMBL26606050 0.86 CNR1 (0.51) CNR1RAB9ANPC1MGLLPOLB
SCHEMBL26606036 0.85 DDX3X (0.59) DDX3XCNR1RAB9ANPC1MGLL
SCHEMBL26606056 0.85 CNR1 (0.53) CNR1RAB9ANPC1MGLLHTT
SCHEMBL26606015 0.84 DDX3X (0.51) DDX3XRAB9ANPC1HTTPOLB
SCHEMBL26606084 0.81 TRPV1 (0.51) DDX3XRAB9ANPC1POLBIDH1
SCHEMBL26606068 0.81 LMNA (0.49) DDX3XRAB9ANPC1HTTCA12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4269119-A1 COLOR DEVELOPER, HEAT-SENSITIVE RECORDING MATERIAL, AND COATING MATERIAL FOR HEAT-SENSITIVE RECORDING LAYERS Sanko Co., Ltd. (JP) 2023-11-01 — — EP disclosed
Send feedback