SCHEMBL26657537

SCHEMBL26657537

CC(C)(C)CC(C)(C)c1ccc(OCCOCc2ccccc2)cc1

nearest known ligand 0.67

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ SMN1; SMN2 Q16637 5/20 0.67
▸ KMT2A Q03164 4/20 0.67
▸ HIF1A Q16665 4/20 0.67
▸ CYP3A4 P08684 3/20 0.67
▸ LMNA P02545 3/20 0.67
▸ TSHR P16473 3/20 0.67
▸ TDP1 Q9NUW8 3/20 0.67
▸ MEN1 O00255 3/20 0.67
▸ APAF1 O14727 3/20 0.67
▸ USP2 O75604 3/20 0.67
▸ ALDH1A1 P00352 3/20 0.67
▸ TP53 P04637 3/20 0.67
▸ MAPT P10636 3/20 0.67
▸ RAD52 P43351 3/20 0.67
▸ ERBB2 P04626 2/20 0.67
▸ FYN P06241 2/20 0.67
▸ CHRM2 P08172 2/20 0.67
▸ CHRM4 P08173 2/20 0.67
▸ CHRM5 P08912 2/20 0.67
▸ ADRA2A P08913 2/20 0.67

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11057809 0.86 SMN1; SMN2 (0.57) SMN1; SMN2KMT2AHIF1ACYP3A4LMNA
SCHEMBL5551026 0.85 KMT2A (0.53) SMN1; SMN2KMT2AHIF1ACYP3A4LMNA
SCHEMBL4288920 0.84 SMN1; SMN2 (0.63) SMN1; SMN2KMT2AHIF1ACYP3A4LMNA
SCHEMBL19074259 0.82 LMNA (0.63) SMN1; SMN2KMT2AHIF1ACYP3A4LMNA
SCHEMBL13930955 0.81 SMN1; SMN2 (0.46) SMN1; SMN2KMT2AHIF1ACYP3A4LMNA
Hydrochloric Acid SCHEMBL9822937 0.81 SMN1; SMN2 (0.59) SMN1; SMN2KMT2AHIF1ACYP3A4LMNA
Hydrochloric Acid SCHEMBL2761472 0.81 LMNA (0.61) SMN1; SMN2KMT2AHIF1ACYP3A4LMNA
Benzethonium SCHEMBL122985 0.81 SMN1; SMN2 (1.00) SMN1; SMN2KMT2AHIF1ACYP3A4LMNA
SCHEMBL16326281 0.81 TSHR (0.61) SMN1; SMN2KMT2AHIF1ACYP3A4LMNA
SCHEMBL15239707 0.80 CYP3A4 (0.66) SMN1; SMN2KMT2AHIF1ACYP3A4LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11802240-B2 Silicon etching solution, silicon etching method, and method of producing silicon fin structure TOKYO OHKA KOGYO CO., LTD. (JP) 2023-10-31 — — US disclosed
US-11802240-B2 Silicon etching solution, silicon etching method, and method of producing silicon fin structure TOKYO OHKA KOGYO CO., LTD. (JP) 2023-10-31 — — US disclosed
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