⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL204008 | 0.91 | CA1 (0.35) | — | |
| SCHEMBL11357834 | 0.87 | CA1 (0.38) | — | |
| SCHEMBL113494 | 0.84 | — | — | |
| SCHEMBL9231689 | 0.82 | — | — | |
| Potassium SCHEMBL30715495 | 0.81 | — | — | |
| SCHEMBL30715500 | 0.81 | — | — | |
| Water SCHEMBL27949772 | 0.81 | — | — | |
| SCHEMBL9149406 | 0.81 | — | — | |
| Ammonia Solution, Strong SCHEMBL8627775 | 0.81 | MAOA (0.36) | — | |
| SCHEMBL7525180 | 0.80 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 85 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-56110934-A | — | — | None | — | — | JP | disclosed |
| JP-62121754-A | — | — | None | — | — | JP | disclosed |
| JP-57173941-A | — | — | None | — | — | JP | disclosed |
| JP-55155348-A | — | — | None | — | — | JP | disclosed |
| JP-59164190-A | — | — | None | — | — | JP | disclosed |
| EP-4692141-A1 | COPOLYMER AND COATING COMPOSITION OR RESIST COMPOSITION CONTAINING COPOLYMER | DIC Corporation (JP) | 2026-02-11 | — | — | EP | disclosed |
| EP-4692146-A1 | LEVELING AGENT, RESIST COMPOSITION, AND POLARIZING PLATE | DIC Corporation (JP) | 2026-02-11 | — | — | EP | disclosed |
| US-20260016621-A1 | SILICONE-CONTAINING COPOLYMER, LEVELING AGENT, COATING COMPOSITION, RESIST COMPOSITION, COLOR FILTER, AND SILICONE-CONTAINING COPOLYMER PRODUCTION METHOD | DIC CORPORATION (JP) | 2026-01-15 | — | — | US | disclosed |
| EP-4620986-A1 | RANDOM COPOLYMER, COATING COMPOSITION AND RESIST COMPOSITION CONTAINING SAID COPOLYMER | DIC Corporation (JP) | 2025-09-24 | — | — | EP | disclosed |
| EP-4617773-A1 | RESIST COMPOSITION AND CURED PRODUCT OF SAME | DIC Corporation (JP) | 2025-09-17 | — | — | EP | disclosed |
| US-5518864-A | PHOTOSENSITIVE, QUINONE DIAZIDE | KABUSHIKI KAISHA TOSHIBA (JP) | 1996-05-21 | — | — | US | disclosed |
| US-5348835-A | Without photoresist | KABUSHIKI KAISHA TOSHIBA (JP) | 1994-09-20 | — | — | US | disclosed |
| EP-0478321-A1 | Photosenstive resin composition for forming polyimide film pattern and method of forming polyimide film pattern | KABUSHIKI KAISHA TOSHIBA (JP) | 1992-04-01 | — | — | EP | disclosed |
| US-4826752-A | Dry photosensitive lithographic plate comprising a silicon rubber layer containing an aromatic aminosilane | FUJI PHOTO FILM CO., LTD. (JP) | 1989-05-02 | — | — | US | disclosed |
| JP-S62121754-A | POSITIVE TYPE RADIATION-SENSITIVE RESIN COMPOSITION | JAPAN SYNTHETIC RUBBER CO LTD | 1987-06-03 | — | — | JP | disclosed |
| JP-S59164190-A | PREPARATION OF PLANOGRAPHIC ORIGINAL PLATE | FUJI PHOTO FILM CO LTD | 1984-09-17 | — | — | JP | disclosed |
| US-4379827-A | Imaging structure with tellurium metal film and energy sensitive material thereon | ENERGY CONVERSION DEVICES, INC. (US) | 1983-04-12 | — | — | US | disclosed |
| JP-S57173941-A | FORMATION OF POSITIVE TYPE PHOTO RESIST PATTERN | OKI ELECTRIC IND CO LTD | 1982-10-26 | — | — | JP | disclosed |
| JP-S56110934-A | PROCESSING SOLUTION FOR PHOTOSENSITIVE LAMINATE HAVING ALCOHOL-SOLUBLE POLYAMIDE LAYER | DAICEL CHEM IND LTD | 1981-09-02 | — | — | JP | disclosed |
| JP-S55155348-A | PHOTOSENSITIVE IMAGE FORMING MATERIAL | DAICEL CHEM IND LTD | 1980-12-03 | — | — | JP | disclosed |