SCHEMBL2678741

SCHEMBL2678741

c1ccc2cc(Cc3nc4ccccc4[nH]3)ccc2c1

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 4/20 0.69
LMNA P02545 4/20 0.69
GAA P10253 2/20 0.68
GRIN1 Q05586 1/20 0.64
GRIN2B Q13224 1/20 0.64
POLB P06746 2/20 0.63
NPC1 O15118 3/20 0.60
RAB9A P51151 3/20 0.60
MEN1 O00255 1/20 0.60
TP53 P04637 1/20 0.60
MAPK1 P28482 1/20 0.60
HTT P42858 1/20 0.60
KMT2A Q03164 1/20 0.60
MAPT P10636 1/20 0.56
ALKBH3 Q96Q83 1/20 0.54
PKM P14618 2/20 0.53
HTR6 P50406 1/20 0.53
DDAH1 O94760 1/20 0.53
KRAS P01116 1/20 0.52
TSHR P16473 1/20 0.51

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30902073 1.00 SMN1; SMN2 (0.69) SMN1; SMN2LMNAGAAGRIN1GRIN2B
SCHEMBL26113669 0.86 RAB9A (0.69) SMN1; SMN2LMNAGAAPOLBNPC1
SCHEMBL30902074 0.86 RAB9A (0.69) SMN1; SMN2LMNAGAAPOLBNPC1
SCHEMBL30902080 0.84 LMNA (0.53) SMN1; SMN2LMNAGAAGRIN1GRIN2B
SCHEMBL18689827 0.84 EGFR (0.58) SMN1; SMN2LMNAGAAGRIN1GRIN2B
SCHEMBL29212599 0.84 LMNA (0.53) SMN1; SMN2LMNAGAAGRIN1GRIN2B
SCHEMBL18689826 0.84 RAB9A (0.53) SMN1; SMN2LMNAGAAGRIN1GRIN2B
SCHEMBL31305560 0.83 POLB (0.71) SMN1; SMN2LMNAGAAGRIN1GRIN2B
SCHEMBL31305462 0.83 POLB (0.66) SMN1; SMN2LMNAGAAGRIN1GRIN2B
SCHEMBL26110519 0.83 POLB (0.71) SMN1; SMN2LMNAGAAGRIN1GRIN2B

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118002982-A Organic solderability preservative and preparation method and application thereof 广东省科学院化工研究所 2024-05-10 CN claimed
US-20250215572-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY SHIKOKU CHEMICALS CORPORATION (JP) 2025-07-03 US disclosed
EP-4506488-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY Shikoku Chemicals Corporation (JP) 2025-02-12 EP disclosed
CN-118002982-A Organic solderability preservative and preparation method and application thereof 广东省科学院化工研究所 2024-05-10 CN disclosed
WO-2023190263-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY 四国化成工業株式会社 2023-10-05 WO disclosed
WO-2023190263-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY 四国化成工業株式会社 2023-10-05 WO disclosed
US-8174004-B2 Organic thin film transistor, method of fabricating the same, and gate insulating layer used in the same NATIONAL TSING HUA UNIVERSITY (TW) 2012-05-08 US disclosed
US-20100230662-A1 Organic Thin Film Transistor, Method of Fabricating the Same, and Gate Insulating Layer Used in the Same NATIONAL TSING HUA UNIVERSITY (TW) 2010-09-16 US disclosed
EP-0818562-A1 Composition for treating copper and copper alloy surfaces and method for the surface treatment MEC CO., Ltd. (JP) 1998-01-14 EP disclosed