SCHEMBL2679459

SCHEMBL2679459

CCCCCCCCCCCCCCCCCc1nc2ccc(C)cc2[nH]1

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 4/20 0.79
POLB P06746 3/20 0.71
MAPT P10636 2/20 0.59
PKM P14618 2/20 0.59
MEN1 O00255 2/20 0.59
KDM4E B2RXH2 1/20 0.59
TDP1 Q9NUW8 1/20 0.59
L3MBTL1 Q9Y468 1/20 0.59
NPC1 O15118 1/20 0.57
RAB9A P51151 1/20 0.57
GFER P55789 1/20 0.57
CYP1A2 P05177 1/20 0.52
CYP3A4 P08684 1/20 0.52
CYP2D6 P10635 1/20 0.52
CYP2C9 P11712 1/20 0.52
CYP2C19 P33261 1/20 0.52
PTGS2 P35354 1/20 0.52

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9721021 1.00 KMT2A (0.79) KMT2APOLBMAPTPKMMEN1
SCHEMBL9721027 1.00 KMT2A (0.79) KMT2APOLBMAPTPKMMEN1
SCHEMBL9721015 1.00 KMT2A (0.79) KMT2APOLBMAPTPKMMEN1
SCHEMBL2947746 1.00 KMT2A (0.79) KMT2APOLBMAPTPKMMEN1
SCHEMBL9721041 1.00 KMT2A (0.79) KMT2APOLBMAPTPKMMEN1
SCHEMBL9721050 0.98 KMT2A (0.82) KMT2APOLBMAPTPKMMEN1
SCHEMBL9720980 0.94 KMT2A (0.84) KMT2APOLBMAPTPKMMEN1
SCHEMBL9721038 0.88 KMT2A (0.60) KMT2APOLBMAPTPKMMEN1
SCHEMBL9721008 0.88 KMT2A (0.60) KMT2APOLBMAPTPKMMEN1
SCHEMBL9721019 0.88 KMT2A (0.60) KMT2APOLBMAPTPKMMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5173130-A Immersing copper or alloy to be soldered in an aqueous solution containing a 2-alkylbenzimidazole and an organic acid to form a corrosion and heat resistant protective coating SHIKOKU CHEMICALS CORPORATION (JP) 1992-12-22 US claimed
US-8174004-B2 Organic thin film transistor, method of fabricating the same, and gate insulating layer used in the same NATIONAL TSING HUA UNIVERSITY (TW) 2012-05-08 US disclosed
US-20100230662-A1 Organic Thin Film Transistor, Method of Fabricating the Same, and Gate Insulating Layer Used in the Same NATIONAL TSING HUA UNIVERSITY (TW) 2010-09-16 US disclosed
US-20020067486-A1 Solderability assessment AMERICAN COMPETITIVENESS INSTITUTE 2002-06-06 US disclosed
US-5960251-A Organic-metallic composite coating for copper surface protection INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1999-09-28 US disclosed
US-5173130-A Immersing copper or alloy to be soldered in an aqueous solution containing a 2-alkylbenzimidazole and an organic acid to form a corrosion and heat resistant protective coating SHIKOKU CHEMICALS CORPORATION (JP) 1992-12-22 US disclosed
EP-0428383-A1 Process for surface treatment of copper and copper alloy SHIKOKU CHEMICALS CORPORATION (JP) 1991-05-22 EP disclosed