SCHEMBL2947746

SCHEMBL2947746

CCCCCCc1nc2ccc(C)cc2[nH]1

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 4/20 0.79
POLB P06746 3/20 0.71
MAPT P10636 2/20 0.59
PKM P14618 2/20 0.59
MEN1 O00255 2/20 0.59
KDM4E B2RXH2 1/20 0.59
TDP1 Q9NUW8 1/20 0.59
L3MBTL1 Q9Y468 1/20 0.59
NPC1 O15118 1/20 0.57
RAB9A P51151 1/20 0.57
GFER P55789 1/20 0.57
CYP1A2 P05177 1/20 0.52
CYP3A4 P08684 1/20 0.52
CYP2D6 P10635 1/20 0.52
CYP2C9 P11712 1/20 0.52
CYP2C19 P33261 1/20 0.52
PTGS2 P35354 1/20 0.52

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9721021 1.00 KMT2A (0.79) KMT2APOLBMAPTPKMMEN1
SCHEMBL9721027 1.00 KMT2A (0.79) KMT2APOLBMAPTPKMMEN1
SCHEMBL2679459 1.00 KMT2A (0.79) KMT2APOLBMAPTPKMMEN1
SCHEMBL9721015 1.00 KMT2A (0.79) KMT2APOLBMAPTPKMMEN1
SCHEMBL9721041 1.00 KMT2A (0.79) KMT2APOLBMAPTPKMMEN1
SCHEMBL9721050 0.98 KMT2A (0.82) KMT2APOLBMAPTPKMMEN1
SCHEMBL9720980 0.94 KMT2A (0.84) KMT2APOLBMAPTPKMMEN1
SCHEMBL9721038 0.88 KMT2A (0.60) KMT2APOLBMAPTPKMMEN1
SCHEMBL9721008 0.88 KMT2A (0.60) KMT2APOLBMAPTPKMMEN1
SCHEMBL9721019 0.88 KMT2A (0.60) KMT2APOLBMAPTPKMMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116810216-A Water-soluble pre-flux and surface treatment method 株式会社田村制作所 2023-09-29 CN disclosed
CN-106929839-B Method for forming organic coating on copper surfaces 罗门哈斯电子材料有限责任公司 2019-05-14 CN disclosed
EP-3188577-B1 METHOD FOR FORMING ORGANIC COATING ON COPPER SURFACE ROHM & HAAS ELECT MAT (US) 2019-01-30 EP disclosed
CN-106929839-A Method for forming organic coating on copper surfaces 罗门哈斯电子材料有限责任公司 2017-07-07 CN disclosed
EP-3188577-A1 METHOD FOR FORMING ORGANIC COATING ON COPPER SURFACE Rohm and Haas Electronic Materials LLC (US) 2017-07-05 EP disclosed
US-20170183783-A1 METHOD FOR FORMING ORGANIC COATING ON COPPER SURFACE ROHM & HAAS ELECT MAT (US) 2017-06-29 US disclosed
EP-1886759-B1 WATER-SOLUBLE PREFLUX AND USE THEREOF SHIKOKU CHEM (JP) 2016-10-05 EP disclosed
US-7754105-B2 Water-soluble preflux and usage of the same SHIKOKU CHEMICALS CORPORATION (JP) 2010-07-13 US disclosed
US-20080318070-A1 Water-Soluble Preflux and Usage of the Same SHIKOKU CHEMICALS CORPORATION (JP) 2008-12-25 US disclosed
EP-1886759-A1 WATER-SOLUBLE PREFLUX AND USE THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2008-02-13 EP disclosed
EP-0791671-B1 Surface treating agent for copper or copper alloy SHIKOKU CHEM (JP) 1999-06-16 EP disclosed
US-5795409-A MIXTURE OF A (BENZ)IMIDAZOLE COMPOUND, CHELATE COMPOUND AND IRON SHIKOKU CHEMICALS CORPORATION (JP) 1998-08-18 US disclosed
EP-0791671-A1 Surface treating agent for copper or copper alloy SHIKOKU CHEMICALS CORPORATION (JP) 1997-08-27 EP disclosed
US-5173130-A Immersing copper or alloy to be soldered in an aqueous solution containing a 2-alkylbenzimidazole and an organic acid to form a corrosion and heat resistant protective coating SHIKOKU CHEMICALS CORPORATION (JP) 1992-12-22 US disclosed
EP-0428383-A1 Process for surface treatment of copper and copper alloy SHIKOKU CHEMICALS CORPORATION (JP) 1991-05-22 EP disclosed