SCHEMBL9720980

SCHEMBL9720980

CCCCc1nc2ccc(C)cc2[nH]1

nearest known ligand 0.88

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 4/20 0.84
POLB P06746 2/20 0.76
MEN1 O00255 2/20 0.59
NPC1 O15118 1/20 0.59
RAB9A P51151 1/20 0.59
GFER P55789 1/20 0.59
CYP1A2 P05177 1/20 0.55
CYP3A4 P08684 1/20 0.55
CYP2D6 P10635 1/20 0.55
CYP2C9 P11712 1/20 0.55
CYP2C19 P33261 1/20 0.55
MAPT P10636 3/20 0.54
PKM P14618 2/20 0.54
KDM4E B2RXH2 2/20 0.54
TDP1 Q9NUW8 1/20 0.54
L3MBTL1 Q9Y468 1/20 0.54
PDE10A Q9Y233 1/20 0.50
ALDH1A1 P00352 1/20 0.49
LMNA P02545 1/20 0.49
KCNJ1 P48048 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9721050 0.95 KMT2A (0.82) KMT2APOLBMEN1NPC1RAB9A
SCHEMBL9721015 0.94 KMT2A (0.79) KMT2APOLBMEN1NPC1RAB9A
SCHEMBL9721041 0.94 KMT2A (0.79) KMT2APOLBMEN1NPC1RAB9A
SCHEMBL2947746 0.94 KMT2A (0.79) KMT2APOLBMEN1NPC1RAB9A
SCHEMBL9721027 0.94 KMT2A (0.79) KMT2APOLBMEN1NPC1RAB9A
SCHEMBL2679459 0.94 KMT2A (0.79) KMT2APOLBMEN1NPC1RAB9A
SCHEMBL9721021 0.94 KMT2A (0.79) KMT2APOLBMEN1NPC1RAB9A
SCHEMBL6757227 0.90 KMT2A (0.81) KMT2APOLBMEN1NPC1RAB9A
SCHEMBL9720977 0.87 KMT2A (0.64) KMT2APOLBMEN1NPC1RAB9A
SCHEMBL10142439 0.83 KMT2A (0.74) KMT2APOLBMEN1NPC1RAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5173130-A Immersing copper or alloy to be soldered in an aqueous solution containing a 2-alkylbenzimidazole and an organic acid to form a corrosion and heat resistant protective coating SHIKOKU CHEMICALS CORPORATION (JP) 1992-12-22 US disclosed
EP-0428383-A1 Process for surface treatment of copper and copper alloy SHIKOKU CHEMICALS CORPORATION (JP) 1991-05-22 EP disclosed