SCHEMBL268348

SCHEMBL268348

C[Si](C)(C)CNc1ccccc1

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.48
MAPT P10636 2/20 0.48
MAOA P21397 1/20 0.42
MAOB P27338 1/20 0.42
TSHR P16473 2/20 0.42
L3MBTL1 Q9Y468 1/20 0.41
MEN1 O00255 2/20 0.39
KMT2A Q03164 2/20 0.39
CYP1A2 P05177 1/20 0.39
CYP3A4 P08684 1/20 0.39
CYP2C9 P11712 1/20 0.39
CYP2C19 P33261 1/20 0.39
LTA4H P09960 1/20 0.39
CTSD P07339 1/20 0.39
TDP1 Q9NUW8 1/20 0.39
HSD17B10 Q99714 1/20 0.39
NPC1 O15118 2/20 0.39
RAB9A P51151 2/20 0.39
SMN1; SMN2 Q16637 2/20 0.39
HTT P42858 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22911703 0.81 MAPT (0.44) ALDH1A1MAPTMAOAMAOBTSHR
SCHEMBL57449 0.78 MAPT (0.42) ALDH1A1MAPTMAOAMAOBTSHR
SCHEMBL28480015 0.78 ALDH1A1 (0.41) ALDH1A1MAPTMAOAMAOBTSHR
SCHEMBL6244058 0.78 MAPT (0.41) ALDH1A1MAPTMAOAMAOBTSHR
SCHEMBL978043 0.78 MAPT (0.42) ALDH1A1MAPTMAOAMAOBTSHR
SCHEMBL27675077 0.76 MAPT (0.56) ALDH1A1MAPTMAOAMAOBTSHR
SCHEMBL28435110 0.76 MAPT (0.44) ALDH1A1MAPTMAOAMAOBTSHR
SCHEMBL5718645 0.76 APP (0.43) ALDH1A1MAPTMAOAMAOBTSHR
SCHEMBL4536271 0.75 ALDH1A1 (0.48) ALDH1A1MAPTMAOAMAOBTSHR
Hydrochloric Acid SCHEMBL6048029 0.75 APP (0.42) ALDH1A1MAPTMAOAMAOBTSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 291 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111393646-A Low-dielectric and low-loss polyimide composite material, and preparation method and application thereof 上海国瓷新材料技术有限公司 2020-07-10 CN claimed
CN-108329877-A A kind of modified epoxide resin adhesive and preparation method thereof 滕凤琴 2018-07-27 CN claimed
CN-116143680-B Indolines compound pyrrolidone indoline compound and preparation thereof 深圳湾实验室 2024-08-30 CN disclosed
CN-116143680-A Indoline compound, pyrrolidone indoline compound and preparation thereof 深圳湾实验室 2023-05-23 CN disclosed
CN-111393646-A Low-dielectric and low-loss polyimide composite material, and preparation method and application thereof 上海国瓷新材料技术有限公司 2020-07-10 CN disclosed
EP-2857436-B1 POLYMER HAVING TERMINAL STRUCTURE INCLUDING PLURALITY OF REACTIVE SILICON GROUPS, METHOD FOR MANUFACTURING SAME, AND USE FOR SAME KANEKA CORP (JP) 2019-10-09 EP disclosed
CN-105950027-B A kind of epoxyn and preparation method thereof 航天材料及工艺研究所 2019-08-09 CN disclosed
CN-108329877-A A kind of modified epoxide resin adhesive and preparation method thereof 滕凤琴 2018-07-27 CN disclosed
CN-108329877-A A kind of modified epoxide resin adhesive and preparation method thereof 滕凤琴 2018-07-27 CN disclosed
US-9969843-B2 Polymer having terminal structure including plurality of reactive silicon groups, method for manufacturing same, and use for same KANEKA CORPORATION (JP) 2018-05-15 US disclosed
US-9803052-B2 Polymer having terminal structure including plurality of reactive silicon groups, method for manufacturing same, and use for same KANEKA CORPORATION (JP) 2017-10-31 US disclosed
EP-1152294-A2 Photosensitive image-recording material Fuji Photo Film Co., Ltd. (JP) 2001-11-07 EP disclosed
EP-1091251-A2 Lithographic printing plate precursor FUJI PHOTO FILM CO., LTD. (JP) 2001-04-11 EP disclosed
EP-1070990-A1 Photosensitive composition and method of making lithographic printing plate FUJI PHOTO FILM CO., LTD. (JP) 2001-01-24 EP disclosed
EP-1048982-A1 Photopolymerizable composition for short wavelenght semiconductor laser exposure, photosensitive composition and method for polymerizing photosensitive composition FUJI PHOTO FILM CO., LTD. (JP) 2000-11-02 EP disclosed
EP-1035435-A2 Photosensitive composition and 1,3-dihydro-1-oxo-2H-indene derivative FUJI PHOTO FILM CO., LTD. (JP) 2000-09-13 EP disclosed
EP-0985683-A1 Photosensitive composition and method for manufacturing lithographic printing plate FUJI PHOTO FILM CO., LTD. (JP) 2000-03-15 EP disclosed
EP-0770084-A1 SILYLMETHYL-ANILINE DERIVATIVES, METHODS OF PREPARATION AND USE THEREOF AS DRUGS PIERRE FABRE MEDICAMENT (FR) 1997-05-02 EP disclosed
WO-1996001830-A1 SILYLMETHYL-ANILINE DERIVATIVES, METHODS OF PREPARATION AND USE THEREOF AS DRUGS PIERRE FABRE MEDICAMENT (FR) 1996-01-25 WO disclosed
EP-0457212-A1 Novel organic silicon compound, method of its production, and photoreceptor for electrophotography incorporating it Kao Corporation (JP) 1991-11-21 EP disclosed