SCHEMBL2686984

SCHEMBL2686984

CC(=CC(C)(OC1CCCC1)OC1CCCC1)C(=O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2945699 0.71 EPHX1 (0.33)
SCHEMBL15986196 0.71 EPHX1 (0.33)
SCHEMBL10578670 0.70 CYP19A1 (0.31)
SCHEMBL701590 0.70 EPHX1 (0.37)
SCHEMBL3871375 0.70 EPHX1 (0.37)
SCHEMBL9225399 0.70 EPHX1 (0.33)
SCHEMBL4197536 0.70 EPHX1 (0.40)
SCHEMBL4191718 0.69 EPHX1 (0.38)
SCHEMBL9627099 0.69 CD81 (0.35)
SCHEMBL25473117 0.69 EPHX1 (0.34)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9469763-B2 Photo-curable organic-inorganic hybrid resin composition DONGJIN SEMICHEM CO., LTD. (KR) 2016-10-18 US claimed
US-9239518-B2 Photosensitive resin composition and method of forming pattern using the same SAMSUNG DISPLAY CO., LTD. (KR) 2016-01-19 US claimed
US-20140234776-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE SAME SAMSUNG DISPLAY CO., LTD. (KR) 2014-08-21 US claimed
US-20140212809-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE SAME SAMSUNG DISPLAY CO., LTD. (KR) 2014-07-31 US claimed
US-20140135413-A1 PHOTO-CURABLE ORGANIC-INORGANIC HYBRID RESIN COMPOSITION DONGJIN SEMICHEM CO., LTD. (KR) 2014-05-15 US claimed
US-20090030103-A1 METHOD OF FABRICATING A THIN FILM TRANSISTOR SUBSTRATE AND A PHOTOSENSITIVE COMPOSITION USED IN THE THIN FILM TRANSISTOR SUBSTRATE SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-01-29 US claimed
US-7101650-B2 Photosensitive resin composition for photoresist DONGJIN SEMICHEM CO., LTD. (KR) 2006-09-05 US claimed
US-20050042536-A1 Photosensitive resin composition comprising quinonediazide sulfate ester compound DONGJIN SEMICHEM CO. LTD. (KR) 2005-02-24 US claimed
WO-2003036388-A1 PHOTOSNESITIVE RESIN COMPOSITION COMPRISING QUINONEDIAZIDE SULFATE ESTER COMPOUND DONGJIN SEMICHEM CO., LTD. (KR) 2003-05-01 WO claimed
US-9851635-B2 Photoresist composition and method of manufacturing substrate for display device by using the same SAMSUNG DISPLAY CO., LTD. (KR) 2017-12-26 US disclosed
US-9469763-B2 Photo-curable organic-inorganic hybrid resin composition DONGJIN SEMICHEM CO., LTD. (KR) 2016-10-18 US disclosed
US-20160018731-A1 PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING SUBSTRATE FOR DISPLAY DEVICE BY USING THE SAME MERCK PATENT GMBH (DE) 2016-01-21 US disclosed
US-9239518-B2 Photosensitive resin composition and method of forming pattern using the same SAMSUNG DISPLAY CO., LTD. (KR) 2016-01-19 US disclosed
US-8936744-B2 Photocurable resin composition containing fluorine and method for producing a resin mold using same DONGJIN SEMICHEM CO., LTD. (KR) 2015-01-20 US disclosed
US-20120328991-A1 METHOD OF FABRICATING A THIN FILM TRANSISTOR SUBSTRATE AND A PHOTOSENSITIVE COMPOSITION USED IN THE THIN FILM TRANSISTOR SUBSTRATE SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-12-27 US disclosed
US-8278021-B2 Method of fabricating a thin film transistor substrate and a photosensitive composition used in the thin film transistor substrate SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-10-02 US disclosed
US-20120114906-A1 PHOTOCURABLE RESIN COMPOSITION CONTAINING FLUORINE AND METHOD FOR PRODUCING A RESIN MOLD USING SAME DONGJIN SEMICHEM CO., LTD (KR) 2012-05-10 US disclosed
US-20090030103-A1 METHOD OF FABRICATING A THIN FILM TRANSISTOR SUBSTRATE AND A PHOTOSENSITIVE COMPOSITION USED IN THE THIN FILM TRANSISTOR SUBSTRATE SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-01-29 US disclosed
US-20050042536-A1 Photosensitive resin composition comprising quinonediazide sulfate ester compound DONGJIN SEMICHEM CO. LTD. (KR) 2005-02-24 US disclosed
WO-2003036388-A1 PHOTOSNESITIVE RESIN COMPOSITION COMPRISING QUINONEDIAZIDE SULFATE ESTER COMPOUND DONGJIN SEMICHEM CO., LTD. (KR) 2003-05-01 WO disclosed