Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | EPHX1 | P07099 | 1/20 | 0.37 |
| ▸ | TUBB1 | Q9H4B7 | 1/20 | 0.36 |
| ▸ | SSTR4 | P31391 | 1/20 | 0.33 |
| ▸ | KEAP1 | Q14145 | 1/20 | 0.30 |
| ▸ | NFE2L2 | Q16236 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL701590 | 0.85 | EPHX1 (0.37) | EPHX1TUBB1SSTR4KEAP1NFE2L2 | |
| SCHEMBL7618010 | 0.82 | EPHX1 (0.34) | EPHX1TUBB1SSTR4KEAP1NFE2L2 | |
| SCHEMBL10815498 | 0.82 | EPHX1 (0.34) | EPHX1TUBB1SSTR4KEAP1NFE2L2 | |
| SCHEMBL479255 | 0.82 | EPHX1 (0.34) | EPHX1TUBB1SSTR4KEAP1NFE2L2 | |
| SCHEMBL7618007 | 0.82 | EPHX1 (0.34) | EPHX1TUBB1SSTR4KEAP1NFE2L2 | |
| SCHEMBL27683450 | 0.77 | TUBB1 (0.32) | EPHX1TUBB1 | |
| SCHEMBL1581230 | 0.75 | GRIK1 (0.33) | EPHX1TUBB1 | |
| SCHEMBL11122467 | 0.73 | GRIK1 (0.37) | EPHX1 | |
| SCHEMBL2994782 | 0.72 | CES2 (0.31) | — | |
| SCHEMBL27173977 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4372030-A1 | CURABLE RESIN COMPOSITION | Namics Corporation (JP) | 2024-05-22 | — | — | EP | disclosed |
| EP-4372021-A1 | CURABLE RESIN COMPOSITION | Namics Corporation (JP) | 2024-05-22 | — | — | EP | disclosed |
| WO-2024089905-A1 | RESIN COMPOSITION, ADHESIVE, SEALANT, CURED PRODUCT, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT | NAMICS CORPORATION (JP) | 2024-05-02 | — | — | WO | disclosed |
| WO-2024089906-A1 | RESIN COMPOSITION, ADHESIVE, SEALANT, CURED PRODUCT AND SEMICONDUCTOR DEVICE | NAMICS CORPORATION (JP) | 2024-05-02 | — | — | WO | disclosed |
| US-20200201176-A1 | Resist Composition and Resist Pattern Forming Method | TOKYO ELECTRON LIMITED (JP) | 2020-06-25 | — | — | US | disclosed |
| US-20190146340-A1 | RADIATION-SENSITIVE RESIN COMPOSITION AND RESIST PATTERN-FORMING METHOD | JSR CORPORATION (JP) | 2019-05-16 | — | — | US | disclosed |
| US-9587065-B2 | Composition for pattern formation, and pattern-forming method | JSR CORPORATION (JP) | 2017-03-07 | — | — | US | disclosed |
| US-20150323870-A1 | COMPOSITION FOR PATTERN FORMATION, AND PATTERN-FORMING METHOD | JSR CORPORATION (JP) | 2015-11-12 | — | — | US | disclosed |
| US-7521169-B2 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2009-04-21 | — | — | US | disclosed |
| US-20060234153-A1 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2006-10-19 | — | — | US | disclosed |