⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31470932 | 0.73 | — | — | |
| SCHEMBL15195131 | 0.73 | — | — | |
| SCHEMBL28141431 | 0.73 | SLC1A3 (0.42) | — | |
| SCHEMBL428684 | 0.73 | — | — | |
| SCHEMBL427317 | 0.73 | — | — | |
| SCHEMBL25078714 | 0.73 | — | — | |
| SCHEMBL427318 | 0.73 | — | — | |
| SCHEMBL28154143 | 0.73 | SLC1A3 (0.42) | — | |
| SCHEMBL11874948 | 0.71 | — | — | |
| SCHEMBL4604111 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 60 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11965109-B2 | Semiconductor film composition, method for manufacturing semiconductor film composition, method for manufacturing semiconductor member, method for manufacturing semiconductor processing material, and semiconductor device | MITSUI CHEMICALS, INC. (JP) | 2024-04-23 | — | — | US | disclosed |
| WO-2024029390-A1 | METHOD FOR PRODUCING SUBSTRATE LAMINATE AND SEMICONDUCTOR DEVICE | 三井化学株式会社 | 2024-02-08 | — | — | WO | disclosed |
| WO-2024010007-A1 | SUBSTRATE LAYERED BODY MANUFACTURING METHOD AND SUBSTRATE LAYERED BODY | 三井化学株式会社 | 2024-01-11 | — | — | WO | disclosed |
| US-11859110-B2 | Substrate laminated body and method of manufacturing substrate laminated body | MITSUI CHEMICALS, INC. (JP) | 2024-01-02 | — | — | US | disclosed |
| CN-117070147-A | Composition for producing film for semiconductor device and method for producing same | 三井化学株式会社 | 2023-11-17 | — | — | CN | disclosed |
| EP-3616903-B1 | SUBSTRATE LAMINATED BODY AND METHOD FOR MANUFACTURING SUBSTRATE LAMINATED BODY | MITSUI CHEMICALS INC (JP) | 2023-09-27 | — | — | EP | disclosed |
| CN-108352320-B | Film composition for semiconductor, method for producing same, and semiconductor device | 三井化学株式会社 | 2023-09-08 | — | — | CN | disclosed |
| CN-108292604-B | Film composition for semiconductor, method for producing member for semiconductor, method for producing processing material for semiconductor, and semiconductor device | 三井化学株式会社 | 2023-02-21 | — | — | CN | disclosed |
| EP-3553039-B1 | GLASS ARTICLE WITH COLORED COATING | CENTRAL GLASS CO LTD (JP) | 2022-08-17 | — | — | EP | disclosed |
| CN-110545997-B | Substrate laminate and method for manufacturing substrate laminate | 三井化学株式会社 | 2022-05-24 | — | — | CN | disclosed |
| US-20140367868-A1 | SEALING COMPOSITION FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME, AND POLYMER AND METHOD OF PRODUCING THE SAME | MITSUI CHEMICALS, INC. (JP) | 2014-12-18 | — | — | US | disclosed |
| EP-2806454-A1 | SEMICONDUCTOR SEALING COMPOSITION, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME, AND POLYMER AND METHOD FOR PRODUCING SAME | Mitsui Chemicals, Inc. (JP) | 2014-11-26 | — | — | EP | disclosed |
| US-20120108703-A1 | SURFACE PROTECTIVE AGENT | NITTO BOSEKI CO., LTD. (JP) | 2012-05-03 | — | — | US | disclosed |
| EP-2072582-B1 | POLYMERIC COMPOSITION COMPRISING METAL ALKOXIDE CONDENSATION PRODUCT, ORGANIC SILANE COMPOUND AND BORON COMPOUND | NITTO BOSEKI CO LTD (JP) | 2011-12-07 | — | — | EP | disclosed |
| US-7709597-B2 | Polymer made from organosilane compound and boron compound | NITTO BOSEKI CO., LTD. (JP) | 2010-05-04 | — | — | US | disclosed |
| US-20090252970-A1 | POLYMERIC COMPOSITION COMPRISING METAL ALKOXIDE CONDENSATION PRODUCT, ORGANIC SILANE COMPOUND AND BORON COMPOUND | NITTO BOSEKI CO., LTD. (JP) | 2009-10-08 | — | — | US | disclosed |
| EP-2072582-A1 | POLYMERIC COMPOSITION COMPRISING METAL ALKOXIDE CONDENSATION PRODUCT, ORGANIC SILANE COMPOUND AND BORON COMPOUND | Nitto Boseki CO., LTD. (JP) | 2009-06-24 | — | — | EP | disclosed |
| US-20090082501-A1 | Polymer made from organosilane compound and boron compound | NITTO BOSEKI CO., LTD. (JP) | 2009-03-26 | — | — | US | disclosed |
| EP-1887025-A1 | POLYMER MADE FROM ORGANOSILANE COMPOUND AND BORON COMPOUND | NITTO BOSEKI CO., LTD. (JP) | 2008-02-13 | — | — | EP | disclosed |
| US-4110404-A | Hydrocarbonylation | CELANESE CORPORATION (US) | 1978-08-29 | — | — | US | disclosed |