SCHEMBL2693553

SCHEMBL2693553

[CH2]CCC(N)(N)N

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL358754 0.69
SCHEMBL2369627 0.67
SCHEMBL2472454 0.65
SCHEMBL23451780 0.64
SCHEMBL27901855 0.63 FDPS (0.33)
SCHEMBL28376344 0.58
SCHEMBL21490 0.58
SCHEMBL958653 0.58
SCHEMBL18748 0.58
SCHEMBL30987000 0.58

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 390 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5468747-A Fungicidal compositions and methods of use employing pyrimidine derivatives ZENECA LIMITED (GB) 1995-11-21 US claimed
US-11965109-B2 Semiconductor film composition, method for manufacturing semiconductor film composition, method for manufacturing semiconductor member, method for manufacturing semiconductor processing material, and semiconductor device MITSUI CHEMICALS, INC. (JP) 2024-04-23 US disclosed
WO-2024029390-A1 METHOD FOR PRODUCING SUBSTRATE LAMINATE AND SEMICONDUCTOR DEVICE 三井化学株式会社 2024-02-08 WO disclosed
WO-2024010007-A1 SUBSTRATE LAYERED BODY MANUFACTURING METHOD AND SUBSTRATE LAYERED BODY 三井化学株式会社 2024-01-11 WO disclosed
US-11859110-B2 Substrate laminated body and method of manufacturing substrate laminated body MITSUI CHEMICALS, INC. (JP) 2024-01-02 US disclosed
CN-117070147-A Composition for producing film for semiconductor device and method for producing same 三井化学株式会社 2023-11-17 CN disclosed
EP-3616903-B1 SUBSTRATE LAMINATED BODY AND METHOD FOR MANUFACTURING SUBSTRATE LAMINATED BODY MITSUI CHEMICALS INC (JP) 2023-09-27 EP disclosed
CN-108352320-B Film composition for semiconductor, method for producing same, and semiconductor device 三井化学株式会社 2023-09-08 CN disclosed
WO-2023099609-A1 COMPOSITIONS AND METHODS FOR CONTROLLING PHYTOPATHOGENIC INFECTIONS INSTITUT NATIONAL DE RECHERCHE POUR L'AGRICULTURE, L'ALIMENTATION ET L'ENVIRONNEMENT (INRAE) (FR) 2023-06-08 WO disclosed
EP-4186367-A1 COMPOSITIONS AND METHODS FOR CONTROLLING PHYTOPATHOGENIC INFECTIONS Institut national de recherche pour l'agriculture, l'alimentation et l'environnement (INRAE) (FR) 2023-05-31 EP disclosed
EP-0212859-A2 Fungicides IMPERIAL CHEMICAL INDUSTRIES PLC (GB) 1987-03-04 EP disclosed
EP-0206523-A1 Heterocyclic compounds as fungicides IMPERIAL CHEMICAL INDUSTRIES PLC (GB) 1986-12-30 EP disclosed
CN-86100254-A The method for preparing tertiary amine compounds 1986-10-08 CN disclosed
EP-0193270-A2 Heterocyclic compounds IMPERIAL CHEMICAL INDUSTRIES PLC (GB) 1986-09-03 EP disclosed
CN-85108235-A The preparation of sterilant 1986-08-27 CN disclosed
EP-0188887-A1 Tertiary amine compounds IMPERIAL CHEMICAL INDUSTRIES PLC (GB) 1986-07-30 EP disclosed
CN-85108419-A Kill (very) bacteria composition 1986-07-16 CN disclosed
EP-0178808-A2 Fungicidal 2-(substituted) aminopropenoic acid derivatives IMPERIAL CHEMICAL INDUSTRIES PLC (GB) 1986-04-23 EP disclosed
EP-0178826-A2 Fungicides ZENECA LIMITED (GB) 1986-04-23 EP disclosed
US-4110404-A Hydrocarbonylation CELANESE CORPORATION (US) 1978-08-29 US disclosed