SCHEMBL270010

SCHEMBL270010

C=COCCC(C)OC=C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19113783 0.86
SCHEMBL28211927 0.86
SCHEMBL2128144 0.85
SCHEMBL2152231 0.81
SCHEMBL16318519 0.77 LMNA (0.35)
SCHEMBL408459 0.77
SCHEMBL8647041 0.77 ALOX15 (0.32)
SCHEMBL14780725 0.76
SCHEMBL1115944 0.75
SCHEMBL8150086 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 351 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108271380-B Antifouling composition 佐敦公司 2020-10-23 CN claimed
WO-2017009301-A1 ANTIFOULING COMPOSITION JOTUN A/S (NO) 2017-01-19 WO claimed
EP-1700139-B1 INTRAOCULAR LENS MATERIALS SUITABLE FOR INSERTION THROUGH A SMALL BORE CARTRIDGE ABBOTT MEDICAL OPTICS INC (US) 2009-10-21 EP claimed
CN-1280676-C Positive photoresist composition and method for forming photoresist pattern IND TECH RES INST (CN) 2006-10-18 CN claimed
US-7026091-B2 Positive photoresist composition and patterning process using the same INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2006-04-11 US claimed
US-20050019691-A1 Positive photoresist composition and patterning process using the same INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2005-01-27 US claimed
CN-1570765-A Positive photoresist composition and method for forming photoresist pattern IND TECH RES INST (CN) 2005-01-26 CN claimed
US-5939235-A PHOTOSENSITIVE CURING AGENTS HAVING AT LEAST TWO ENOL ETHER GROUPS; PERMITING THE USE OF LIGHT RAYS EXTENDING OVER A WIDE RANGE OF WAVELENGTH, PROVIDING CLEAR POSITIVE IMAGES AND A WIDE DEVELOPMENT LATITUDE FUJI PHOTO FILM CO., LTD. (JP) 1999-08-17 US claimed
US-5364738-A Divinyl ethers, solubility in developers FUJI PHOTO FILM CO., LTD. (JP) 1994-11-15 US claimed
EP-4685171-A1 CURABLE COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE DIC Corporation (JP) 2026-01-28 EP disclosed
EP-4685185-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, AND CURABLE COMPOUND DIC Corporation (JP) 2026-01-28 EP disclosed
EP-4685172-A1 CURABLE COMPOUND, CURABLE RESIN COMPOSITION, CURED ARTICLE AND LAMINATE DIC Corporation (JP) 2026-01-28 EP disclosed
US-20250320180-A1 HYDROXYL GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND LAYERED PRODUCT DIC CORPORATION (JP) 2025-10-16 US disclosed
US-20250277080-A1 PHENOLIC HYDROXY GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE DIC CORPORATION (JP) 2025-09-04 US disclosed
EP-0560189-A2 Synthetic resin BASF Lacke + Farben AG (DE) 1993-09-15 EP disclosed
EP-0536690-A1 Light-sensitive composition FUJI PHOTO FILM CO., LTD. (JP) 1993-04-14 EP disclosed
EP-0515871-A1 Multiple stage graft copolymer and its use in the preparation of PVC mouldings BASF Aktiengesellschaft (DE) 1992-12-02 EP disclosed
EP-0502375-A1 Multi-stage graft copolymer and its use for the preparation of transparent PVC-moulding compositions BASF Aktiengesellschaft (DE) 1992-09-09 EP disclosed
EP-0496121-A1 Impact-resistant moulding with high transparency BASF Aktiengesellschaft (DE) 1992-07-29 EP disclosed
EP-0489288-A1 Multiples graft polymer and its use in the preparation of PVC moldings BASF Aktiengesellschaft (DE) 1992-06-10 EP disclosed