SCHEMBL2706992

SCHEMBL2706992

Oc1ccc(C2(c3ccc(O)cc3)c3ccccc3-c3ccc(C45CC6CC(CC(C6)C4)C5)c(C45CC6CC(CC(C6)C4)C5)c32)cc1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 4/20 0.35
KMT2A Q03164 4/20 0.35
POLB P06746 2/20 0.35
GAA P10253 1/20 0.35
GFER P55789 1/20 0.35
PDE4D Q08499 2/20 0.35
LMNA P02545 3/20 0.35
MAPT P10636 2/20 0.35
SMN1; SMN2 Q16637 2/20 0.35
KDM4E B2RXH2 1/20 0.35
OPRK1 P41145 1/20 0.35
CNR2 P34972 1/20 0.34
ESR1 P03372 3/20 0.33
EPHX2 P34913 3/20 0.33
ESR2 Q92731 2/20 0.33
ALDH1A1 P00352 2/20 0.33
CHRM2 P08172 1/20 0.33
ADORA3 P0DMS8 1/20 0.33
KCNH2 Q12809 1/20 0.33
TP53 P04637 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2707974 0.88 LMNA (0.35) MEN1KMT2APOLBGAAGFER
SCHEMBL2708455 0.86 ESR1 (0.40) MEN1KMT2APOLBGAAGFER
SCHEMBL2710167 0.86 RARA (0.41) MEN1KMT2APOLBGAALMNA
SCHEMBL3180086 0.83 ESR1 (0.43) MEN1KMT2APOLBGAAGFER
SCHEMBL2710131 0.81 SERPINE1 (0.37) MEN1KMT2APOLBMAPTSMN1; SMN2
SCHEMBL2710483 0.77 EPHX2 (0.33) MEN1KMT2AMAPTEPHX2ALDH1A1
SCHEMBL2708381 0.74 CNR2 (0.32) MAPTCNR2EPHX2TSHRNPC1
SCHEMBL2706988 0.73 MEN1 (0.54) MEN1KMT2APOLBGAAGFER
SCHEMBL2706772 0.71 NCOA1 (0.40) MEN1KMT2ALMNAMAPTSMN1; SMN2
SCHEMBL45826 0.71 MEN1 (0.63) MEN1KMT2APOLBLMNAMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed