SCHEMBL2707487

SCHEMBL2707487

O=C(O)c1ccc(Oc2ccc(C3(c4ccc(Oc5ccc(C(=O)O)cc5)cc4)c4ccccc4-c4ccccc43)cc2)cc1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SRD5A2 P31213 4/20 0.56
PKM P14618 2/20 0.50
GAA P10253 1/20 0.50
PARP10 Q53GL7 2/20 0.49
PARP15 Q460N3 1/20 0.49
MEN1 O00255 2/20 0.46
KMT2A Q03164 2/20 0.46
KDM4E B2RXH2 1/20 0.46
LMNA P02545 1/20 0.46
MAPT P10636 1/20 0.46
OPRK1 P41145 1/20 0.46
SMN1; SMN2 Q16637 1/20 0.46
POLB P06746 3/20 0.46
RXRA P19793 1/20 0.46
RXRB P28702 1/20 0.46
RXRG P48443 1/20 0.46
AKR1C3 P42330 1/20 0.44
PDK2 Q15119 3/20 0.42
NR4A1 P22736 1/20 0.41
NR4A2 P43354 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31147115 1.00 SRD5A2 (0.56) SRD5A2PKMGAAPARP10PARP15
SCHEMBL30934486 0.90 GAA (0.58) SRD5A2PKMGAAMEN1KMT2A
SCHEMBL5667740 0.90 GAA (0.58) SRD5A2PKMGAAMEN1KMT2A
SCHEMBL29995499 0.90 GAA (0.58) SRD5A2PKMGAAMEN1KMT2A
SCHEMBL20010306 0.89 GAA (0.57) SRD5A2PKMGAAMEN1KMT2A
SCHEMBL5669722 0.88 FEN1 (0.48) SRD5A2PKMGAAMEN1KMT2A
SCHEMBL2749253 0.87 AKR1C3 (0.65) SRD5A2PKMPARP10PARP15KDM4E
SCHEMBL5669723 0.86 SRD5A2 (0.54) SRD5A2PKMGAAPARP10PARP15
SCHEMBL15946231 0.85 PKM (0.46) SRD5A2PKMGAAMEN1KMT2A
SCHEMBL22580553 0.85 MEN1 (0.57) GAAMEN1KMT2AKDM4ELMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240043619-A1 POLYIMIDE PRECURSOR RESIN COMPOSITION ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-02-08 US disclosed
WO-2022211086-A1 POLYIMIDE, RESIN COMPOSITION, POLYIMIDE FILM, AND PRODUCTION METHOD THEREFOR 旭化成株式会社 2022-10-06 WO disclosed
US-20210246268-A1 SILICON-CONTAINING COMPOUND SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-08-12 US disclosed
EP-3786213-A1 SILICON-CONTAINING COMPOUND Shin-Etsu Chemical Co., Ltd. (JP) 2021-03-03 EP disclosed
US-20190352463-A1 POLYIMIDE PRECURSOR RESIN COMPOSITION ASAHI KASEI KABUSHIKI KAISHA (JP) 2019-11-21 US disclosed
US-20170165879-A1 RESIN PRECURSOR, RESIN COMPOSITION CONTAINING SAME, POLYIMIDE RESIN MEMBRANE, RESIN FILM, AND METHOD FOR PRODUCING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2017-06-15 US disclosed
US-8859648-B2 Retardation film and polyester resin for optical use TORAY INDUSTRIES, INC. (JP) 2014-10-14 US disclosed
US-8859648-B2 Retardation film and polyester resin for optical use TORAY INDUSTRIES, INC. (JP) 2014-10-14 US disclosed
US-8337982-B2 Comprising first repeating unit obtained by reaction of bisaminophenol compound and dicarboxylic acid, at least one of which has diamondoid structure and second repeating unit obtained by reaction of bisaminophenol compound having no diamondoid structure and dicarboxylic acid; heat resistance SUMITOMO BAKELITE CO., LTD. (JP) 2012-12-25 US disclosed
US-8178631-B2 Resin composition, varnish, resin film and semiconductor device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2012-05-15 US disclosed
US-20070154843-A1 Resin and resin composition ASAHI KASEI EMD CORPORATION (JP) 2007-07-05 US disclosed
EP-1760774-A1 LAMINATED BODY AND SEMICONDUCTOR DEVICE JSR Corporation (JP) 2007-03-07 EP disclosed
EP-1333050-B1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO (JP) 2006-12-27 EP disclosed
EP-1707588-A1 RESIN AND RESIN COMPOSITION Asahi Kasei EMD Corporation (JP) 2006-10-04 EP disclosed
US-7049371-B2 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2006-05-23 US disclosed
US-20040002572-A1 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2004-01-01 US disclosed
EP-1333050-A1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO., LTD. (JP) 2003-08-06 EP disclosed
EP-1327653-A1 HEAT-RESISTANT RESIN PRECURSOR, HEAT-RESISTANT RESIN AND INSULATING FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2003-07-16 EP disclosed
US-6518390-B2 Polybenzoxazole and crosslinking agent SUMITOMO BAKELITE COMPANY, LTD. (JP) 2003-02-11 US disclosed
US-20020013443-A1 Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2002-01-31 US disclosed