SCHEMBL2707884

SCHEMBL2707884

C#Cc1ccccc1Oc1cc(C(=O)O)cc(C(=O)O)c1.c1cc2ccc1-2

nearest known ligand 0.42

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
DHODH Q02127 3/20 0.42
LPAR1 Q92633 1/20 0.42
LPAR5 Q9H1C0 1/20 0.42
EZH2 Q15910 1/20 0.41
AKR1C3 P42330 1/20 0.41
TTR P02766 2/20 0.40
MAPK14 Q16539 1/20 0.39
MEN1 O00255 1/20 0.38
KMT2A Q03164 1/20 0.38
MCL1 Q07820 1/20 0.37
FABP1 P07148 1/20 0.37
EGFR P00533 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5667299 0.96 LPAR1 (0.44) LPAR1LPAR5EZH2AKR1C3TTR
SCHEMBL2746171 0.92 DHODH (0.44) DHODHLPAR1LPAR5EZH2AKR1C3
SCHEMBL11127638 0.80 EZH2 (0.47) DHODHLPAR1LPAR5EZH2AKR1C3
SCHEMBL2746893 0.78 NPC1 (0.43) LPAR1LPAR5AKR1C3TTRMAPK14
SCHEMBL5667931 0.78 FFAR1 (0.41) DHODHLPAR1LPAR5AKR1C3TTR
SCHEMBL5667489 0.78 DHODH (0.42) DHODHLPAR1LPAR5AKR1C3TTR
SCHEMBL6341056 0.75 MRGPRX4 (0.55) LPAR1LPAR5AKR1C3TTRMEN1
SCHEMBL2745853 0.74 KDM4E (0.43) LPAR1LPAR5EZH2AKR1C3TTR
SCHEMBL2748004 0.74 GAA (0.47) EZH2KMT2A
SCHEMBL28423664 0.73 HTT (0.54) AKR1C3TTRMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed