SCHEMBL2707942

SCHEMBL2707942

CC12CC3CC(C1)CC(C)(C3)C2C#Cc1cccc(C(=O)O)c1C(=O)O

nearest known ligand 0.35

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 2/20 0.35
EPHX2 P34913 2/20 0.33
EPHX1 P07099 1/20 0.33
CYP3A4 P08684 1/20 0.32
CYP2D6 P10635 1/20 0.32
CYP2C9 P11712 1/20 0.32
CYP2C19 P33261 1/20 0.32
TDP1 Q9NUW8 1/20 0.32
MEN1 O00255 1/20 0.31
ALDH1A1 P00352 1/20 0.31
GAA P10253 1/20 0.31
MAPT P10636 1/20 0.31
GFER P55789 1/20 0.31
KMT2A Q03164 1/20 0.31
P2RX7 Q99572 1/20 0.30
ALOX15 P16050 1/20 0.30
CNR2 P34972 2/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2710139 0.80 FFAR1 (0.39) KDM4EEPHX2CYP3A4CYP2D6CYP2C9
SCHEMBL2709393 0.80 CYP3A4 (0.30) CYP3A4CYP2D6CYP2C9CYP2C19TDP1
SCHEMBL2707946 0.78 STS (0.34) KDM4EEPHX2CYP3A4TDP1MEN1
SCHEMBL2707899 0.78 STS (0.34) KDM4EEPHX2CYP3A4TDP1MEN1
SCHEMBL2708211 0.76 KDM4E (0.41) KDM4EEPHX2EPHX1MEN1ALDH1A1
SCHEMBL2708226 0.76 KDM4E (0.33) KDM4EEPHX2EPHX1ALDH1A1GAA
SCHEMBL2707916 0.76 FFAR1 (0.36) KDM4EEPHX2
SCHEMBL2707047 0.74 HNF4A (0.35) KDM4EEPHX2CYP3A4CYP2D6CYP2C9
SCHEMBL28226287 0.72 ALDH1A1 (0.48) KDM4ECYP3A4CYP2C9ALDH1A1MAPT
SCHEMBL2706666 0.72 FFAR1 (0.34)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed