SCHEMBL2707952

SCHEMBL2707952

CC12CC3CC(C)(C1)CC(C#Cc1cc(C(=O)O)cc(C(=O)O)c1)(C3)C2

nearest known ligand 0.33

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC8 Q9BY41 2/20 0.33
HDAC6 Q9UBN7 2/20 0.33
EPHX2 P34913 6/20 0.33
RARB P10826 3/20 0.32
RARG P13631 3/20 0.32
RARA P10276 2/20 0.32
CYP26A1 O43174 1/20 0.32
CYP3A4 P08684 1/20 0.32
CRABP2 P29373 1/20 0.32
MEN1 O00255 1/20 0.32
KMT2A Q03164 1/20 0.32
GRIN2D O15399 2/20 0.32
GRIN3B O60391 2/20 0.32
GRIN1 Q05586 2/20 0.32
GRIN2A Q12879 2/20 0.32
GRIN2B Q13224 2/20 0.32
GRIN2C Q14957 2/20 0.32
GRIN3A Q8TCU5 2/20 0.32
HDAC3 O15379 1/20 0.31
HDAC1 Q13547 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2707826 0.81 HNF4A (0.34) HDAC8HDAC6EPHX2RARBRARG
SCHEMBL2708596 0.80 MEN1 (0.36) EPHX2RARBRARGRARACYP3A4
SCHEMBL2707010 0.79 EPHX2 (0.36) HDAC8HDAC6EPHX2RARBRARG
SCHEMBL2707876 0.79 EPHX2 (0.36) HDAC8HDAC6EPHX2RARBRARG
Hydrochloric Acid SCHEMBL2706861 0.79 MEN1 (0.35) EPHX2RARBRARGRARACYP3A4
SCHEMBL2708684 0.79 MEN1 (0.35) EPHX2RARBRARGRARACYP3A4
SCHEMBL2709920 0.77 RARB (0.42) EPHX2RARBRARGRARACYP26A1
SCHEMBL2709090 0.72 RARB (0.40) EPHX2RARBRARGRARACYP26A1
SCHEMBL2709390 0.71 EPHX2 (0.34) HDAC8HDAC6EPHX2MEN1KMT2A
SCHEMBL2707956 0.68

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed