SCHEMBL2707010

SCHEMBL2707010

CC12CC3CC(C)(C1)CC(C#Cc1cc(C(=O)O)ccc1C(=O)O)(C3)C2

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
EPHX2 P34913 7/20 0.36
MYC P01106 1/20 0.35
HDAC6 Q9UBN7 5/20 0.34
HDAC8 Q9BY41 3/20 0.34
HDAC1 Q13547 2/20 0.33
HDAC3 O15379 1/20 0.33
GRIN2D O15399 1/20 0.33
GRIN3B O60391 1/20 0.33
GRIN1 Q05586 1/20 0.33
GRIN2A Q12879 1/20 0.33
GRIN2B Q13224 1/20 0.33
GRIN2C Q14957 1/20 0.33
GRIN3A Q8TCU5 1/20 0.33
HDAC2 Q92769 1/20 0.33
RARA P10276 2/20 0.32
RARB P10826 2/20 0.32
RARG P13631 2/20 0.32
CYP26A1 O43174 1/20 0.32
CYP3A4 P08684 1/20 0.32
CRABP2 P29373 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2707876 0.91 EPHX2 (0.36) EPHX2MYCHDAC6HDAC8HDAC1
SCHEMBL2709686 0.82 STS (0.40) EPHX2RARARARBRARGCYP3A4
SCHEMBL2707826 0.81 HNF4A (0.34) EPHX2HDAC6HDAC8RARARARB
SCHEMBL2710393 0.79 RARB (0.40) EPHX2RARARARBRARGCYP26A1
SCHEMBL2707952 0.79 HDAC8 (0.33) EPHX2HDAC6HDAC8HDAC1HDAC3
SCHEMBL2709390 0.79 EPHX2 (0.34) EPHX2HDAC6HDAC8HDAC1HDAC3
SCHEMBL2708265 0.74 RARB (0.39) RARARARBRARGCYP26A1CYP3A4
SCHEMBL2706953 0.72 STS (0.40) EPHX2RARARARBRARGCYP3A4
SCHEMBL2707011 0.71
SCHEMBL2707899 0.71 STS (0.34) EPHX2MYCRARARARBRARG

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed