SCHEMBL2709093

SCHEMBL2709093

CC12CC3CC(C1)C(c1ccc(Oc4ccc(C#Cc5cc(C(=O)O)cc(C(=O)O)c5)cc4)cc1)C(C)(C3)C2

nearest known ligand 0.35

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
P2RY14 Q15391 1/20 0.35
RARB P10826 4/20 0.34
RARG P13631 4/20 0.34
RARA P10276 3/20 0.34
CYP26A1 O43174 1/20 0.34
CYP3A4 P08684 1/20 0.34
CRABP2 P29373 1/20 0.34
MMP13 P45452 1/20 0.33
RXRA P19793 2/20 0.33
RXRB P28702 1/20 0.33
RXRG P48443 1/20 0.33
HAO1 Q9UJM8 4/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2709922 0.94 P2RY14 (0.38) P2RY14RARBRARGRARACYP26A1
Hydrochloric Acid SCHEMBL5000617 0.93 P2RY14 (0.37) P2RY14RARBRARGRARACYP26A1
SCHEMBL3179400 0.88 CYP26A1 (0.32) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2708266 0.88 RARB (0.33) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2710042 0.88 RARB (0.33) RARBRARGRARACYP26A1CYP3A4
SCHEMBL5000831 0.85 PTPN11 (0.32)
SCHEMBL2709694 0.83 RARB (0.40) P2RY14RARBRARGRARACYP26A1
SCHEMBL2710078 0.82 FFAR1 (0.32) HAO1
SCHEMBL2709691 0.81 HNF4A (0.34) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2710394 0.81 RARB (0.34) RARBRARGRARACYP26A1CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed