SCHEMBL2709694

SCHEMBL2709694

CC12CC3CC(C1)CC(C)(C3)C2c1ccc(Oc2ccc(C#Cc3cc(C(=O)O)cc(C(=O)O)c3)cc2)cc1

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
RARB P10826 8/20 0.40
RARG P13631 8/20 0.40
RARA P10276 6/20 0.40
CYP26A1 O43174 1/20 0.40
CYP3A4 P08684 1/20 0.40
CRABP2 P29373 1/20 0.40
RXRA P19793 2/20 0.38
RXRB P28702 1/20 0.38
RXRG P48443 1/20 0.38
MMP13 P45452 1/20 0.38
P2RY14 Q15391 1/20 0.37
HAO1 Q9UJM8 3/20 0.37
MEN1 O00255 2/20 0.34
KMT2A Q03164 2/20 0.34
GRM3 Q14832 1/20 0.34
FFAR1 O14842 1/20 0.34
NR1I2 O75469 1/20 0.34
LMNA P02545 1/20 0.34
PGR P06401 1/20 0.34
HSPD1 P10809 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2709336 0.94 RARB (0.41) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2709733 0.85 RARA (0.37) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2709793 0.85 RARB (0.38) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2710060 0.85 RARB (0.38) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2709093 0.83 P2RY14 (0.35) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2709664 0.80 MMP13 (0.38) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2708795 0.80 HIF1A (0.49) MMP13MEN1KMT2ALMNA
SCHEMBL2707916 0.79 FFAR1 (0.36) HAO1GRM3FFAR1
SCHEMBL2710763 0.79 HNF4A (0.40) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2710970 0.79 RARB (0.39) RARBRARGRARACYP26A1CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed