SCHEMBL271849

SCHEMBL271849

CO[Si](CCC1(O)CCCCC1)(OC)OC

nearest known ligand 0.38

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
SLC6A2 P23975 4/20 0.31
SLC6A4 P31645 4/20 0.31
SLC6A3 Q01959 4/20 0.31
RYR2 Q92736 1/20 0.31
LMNA P02545 1/20 0.31
CNR1 P21554 1/20 0.31
HTR2A P28223 1/20 0.31
HRH1 P35367 1/20 0.31
HRH3 Q9Y5N1 1/20 0.31
P2RX7 Q99572 3/20 0.31
CYP2C19 P33261 1/20 0.31
BRD4 O60885 1/20 0.31
TSHR P16473 2/20 0.30
USP2 O75604 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9188041 0.80
SCHEMBL7876399 0.73
SCHEMBL6855954 0.73
SCHEMBL16053496 0.71 CYP2C19 (0.33) RYR2P2RX7CYP2C19
SCHEMBL595778 0.71 CYP2C19 (0.37) CYP2C19TSHRUSP2
SCHEMBL31310056 0.71 LMNA (0.32) LMNA
SCHEMBL31306316 0.71
SCHEMBL18037925 0.69 CYP4F2 (0.30)
SCHEMBL401630 0.69 CYP4F2 (0.30)
SCHEMBL19375402 0.69 P2RX7 (0.33) RYR2P2RX7CYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 131 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112912414-B Adhesive bond between thermoplastic and elastomeric compositions SIKA技术股份公司 2023-10-20 CN disclosed
CN-113710746-B Two-component composition with high strength SIKA技术股份公司 2023-10-13 CN disclosed
CN-116848188-A Styrene resin composition 出光兴产株式会社 2023-10-03 CN disclosed
CN-112839917-B Curable composition for alkaline substrates SIKA技术股份公司 2023-08-08 CN disclosed
CN-112955485-B Thixotropic agents for curable compositions SIKA技术股份公司 2023-08-08 CN disclosed
CN-112805313-B Low density curable compositions SIKA技术股份公司 2023-02-28 CN disclosed
EP-4121470-A1 COMPOSITIONS BASED ON SILANE-TERMINATED POLYMERS AND ACETYLENE BLACK Sika Technology AG (CH) 2023-01-25 EP disclosed
EP-4103633-A1 POLYMER CONTAINING SILANE GROUPS Sika Technology AG (CH) 2022-12-21 EP disclosed
EP-4103634-A1 SILANE GROUP-CONTAINING BRANCHED POLYMER Sika Technology AG (CH) 2022-12-21 EP disclosed
CN-115368824-A Fast curing migration-free compositions based on organic polymers containing silane groups SIKA技术股份公司 2022-11-22 CN disclosed
EP-0591823-A1 Thermoplastic resin composition IDEMITSU KOSAN COMPANY LIMITED (JP) 1994-04-13 EP disclosed
EP-0583484-A1 STYRENIC RESIN COMPOSITION IDEMITSU KOSAN COMPANY LIMITED (JP) 1994-02-23 EP disclosed
US-5270353-A Styrene-based polymer, filler IDEMITSU KOSAN CO., LTD. (JP) 1993-12-14 US disclosed
EP-0557836-A2 Resin composition IDEMITSU KOSAN COMPANY LIMITED (JP) 1993-09-01 EP disclosed
US-5219940-A Blended with polyphenylene ether with polar group and polyamide; impact, water resistance, strength IDEMITSU KOSAN CO., LTD. (JP) 1993-06-15 US disclosed
US-5165990-A Styrene Polymer, Reinforcing Fiber IDEMITSU KOSAN CO., LTD. (JP) 1992-11-24 US disclosed
EP-0508303-A1 Thermoplastic resin composition IDEMITSU KOSAN COMPANY LIMITED (JP) 1992-10-14 EP disclosed
EP-0430109-A1 Stampable sheet IDEMITSU KOSAN COMPANY LIMITED (JP) 1991-06-05 EP disclosed
EP-0422495-A1 Styrene polymer composition IDEMITSU KOSAN COMPANY LIMITED (JP) 1991-04-17 EP disclosed
EP-0384208-A2 Resin composition IDEMITSU KOSAN COMPANY LIMITED (JP) 1990-08-29 EP disclosed