SCHEMBL2735009

SCHEMBL2735009

O=C(NS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)c1cccnc1

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PTGS2 P35354 5/20 0.53
HDAC1 Q13547 1/20 0.53
HDAC6 Q9UBN7 1/20 0.53
PTGS1 P23219 2/20 0.50
EGFR P00533 2/20 0.50
PLOD2 O00469 1/20 0.46
PLOD3 O60568 1/20 0.46
PLOD1 Q02809 1/20 0.46
LMNA P02545 2/20 0.46
THRB P10828 1/20 0.46
HIF1A Q16665 1/20 0.46
MEN1 O00255 1/20 0.45
TSHR P16473 1/20 0.45
KMT2A Q03164 1/20 0.45
CYP3A4 P08684 1/20 0.45
SMN1; SMN2 Q16637 2/20 0.44
ROCK2 O75116 1/20 0.44
ROCK1 Q13464 1/20 0.44
MAPK1 P28482 1/20 0.44
NPC1 O15118 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL108479 0.84 PTGS2 (0.60) PTGS2HDAC1HDAC6PTGS1EGFR
SCHEMBL11864560 0.76 HDAC1 (0.66) PTGS2HDAC1HDAC6PTGS1EGFR
SCHEMBL18158124 0.74 PTGS2 (0.54) PTGS2HDAC1HDAC6PTGS1LMNA
SCHEMBL1820805 0.73 HDAC1 (0.66) PTGS2HDAC1HDAC6PTGS1EGFR
SCHEMBL24747018 0.71 CA1 (0.47) HDAC1HDAC6CA1CA2MMP1
SCHEMBL628398 0.71 HDAC1 (0.62) HDAC1HDAC6PLOD2PLOD3PLOD1
Nicoxamat SCHEMBL29824802 0.71 HDAC1 (0.77) PTGS2HDAC1HDAC6PTGS1PLOD2
SCHEMBL30646263 0.70 CA1 (0.46) HDAC1HDAC6CA1CA2MMP1
Nicoxamat SCHEMBL93839 0.70 HDAC1 (1.00) PTGS2HDAC1HDAC6PTGS1PLOD2
Hydrochloric Acid SCHEMBL6828319 0.70 HDAC1 (0.61) PTGS2HDAC1HDAC6PLOD2PLOD3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8877969-B2 Photosensitive composition, compound for use in the photosensitive composition and pattern forming method using the photosensitive composition FUJIFILM CORPORATION (JP) 2014-11-04 US disclosed
US-8877969-B2 Photosensitive composition, compound for use in the photosensitive composition and pattern forming method using the photosensitive composition FUJIFILM CORPORATION (JP) 2014-11-04 US disclosed
US-8785104-B2 Resist composition and pattern forming method using the same FUJIFILM CORPORATION (JP) 2014-07-22 US disclosed
US-8785104-B2 Resist composition and pattern forming method using the same FUJIFILM CORPORATION (JP) 2014-07-22 US disclosed
US-8182975-B2 Positive resist composition and pattern forming method using the same FUJIFILM CORPORATION (JP) 2012-05-22 US disclosed
US-8182975-B2 Positive resist composition and pattern forming method using the same FUJIFILM CORPORATION (JP) 2012-05-22 US disclosed
US-8124310-B2 Positive resist composition and pattern forming method using the same FUJIFILM CORPORATION (JP) 2012-02-28 US disclosed
US-8124310-B2 Positive resist composition and pattern forming method using the same FUJIFILM CORPORATION (JP) 2012-02-28 US disclosed
US-8092978-B2 Positive resist composition for electron beam, X-ray or EUV and pattern forming method using the same FUJIFILM CORPORATION (JP) 2012-01-10 US disclosed
US-8092976-B2 High resolution, reduced pattern falling, and good sensitivity and good dissolution contrast achieved even in EUV (extreme ultra violet) exposure, reduction in the line edge roughness FUJIFILM CORPORATION (JP) 2012-01-10 US disclosed
EP-2034361-A2 Photosensitive composition, compound for use in the photosensitive composition and pattern forming method using the photosensitive composition Fujifilm Corporation (JP) 2009-03-11 EP disclosed
US-20090035692-A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING MEHTOD FUJIFILM CORPORATION (JP) 2009-02-05 US disclosed
US-20090035692-A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING MEHTOD FUJIFILM CORPORATION (JP) 2009-02-05 US disclosed
US-20080248419-A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2008-10-09 US disclosed
US-20080248419-A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2008-10-09 US disclosed
US-20080085468-A1 microlithography; ultrafine processing of semiconductor using electron beam, X-ray or deep UV; high sensitivity, high resolution and good line edge roughness; suppression of vaporized outgas; a polystyrene with an acid-decomposable group; 10-tolyl-9-oxothioxanthenium nonafluorobutanesulfonate FUJIFILM CORPORATION (JP) 2008-04-10 US disclosed
US-20080085468-A1 microlithography; ultrafine processing of semiconductor using electron beam, X-ray or deep UV; high sensitivity, high resolution and good line edge roughness; suppression of vaporized outgas; a polystyrene with an acid-decomposable group; 10-tolyl-9-oxothioxanthenium nonafluorobutanesulfonate FUJIFILM CORPORATION (JP) 2008-04-10 US disclosed
US-20080081282-A1 RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2008-04-03 US disclosed
US-20080081282-A1 RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2008-04-03 US disclosed
EP-1906248-A1 Resist composition and pattern forming method using the same FUJIFILM Corporation (JP) 2008-04-02 EP disclosed