SCHEMBL273629

SCHEMBL273629

Cc1nccn1C(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26111243 0.98 ALDH1A1 (0.36)
Iodide SCHEMBL5531813 0.98 ALDH1A1 (0.36)
SCHEMBL9210148 0.81
SCHEMBL15917807 0.81
SCHEMBL467175 0.81
SCHEMBL24243580 0.81
SCHEMBL28035566 0.81
SCHEMBL21629869 0.78
SCHEMBL28124622 0.78
SCHEMBL2932043 0.78 KMT2A (0.41)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 376 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250163261-A1 LOW-DIELECTRIC RESIN COMPOSITION NAN YA PLASTICS CORPORATION (TW) 2025-05-22 US claimed
CN-120005486-A Low dielectric resin composition 南亚塑胶工业股份有限公司 2025-05-16 CN claimed
CN-111511809-B Curing agent composition and resin composition containing the same 赫克塞尔合成有限公司 2024-08-16 CN claimed
CN-111116870-B Latent resin composition, prepreg and epoxy composite material 浙江华正新材料股份有限公司 2023-12-26 CN claimed
CN-113107746-B Oscillating water column type wave energy power supply device based on dielectric elastomer material 湖南国天电子科技有限公司 2023-03-10 CN claimed
CN-111333767-B Polyion liquid nano hydrogel plugging agent and water-based drilling fluid 西南石油大学 2021-08-31 CN claimed
CN-113107746-A Oscillation water column type wave energy power supply device based on dielectric elastomer material 湖南国天电子科技有限公司 2021-07-13 CN claimed
US-20200385536-A1 A CURATIVE COMPOSITION AND A RESIN COMPOSITION CONTAINING THE CURATIVE COMPOSITION HEXCEL COMPOSITES LIMITED (GB) 2020-12-10 US claimed
US-10851201-B2 Curing agent for thermosetting epoxy resins, and a process for the preparation of insulation systems for electrical engineering HUNTSMAN INTERNATIONAL LLC (US) 2020-12-01 US claimed
CN-107636039-B Curing agent for thermosetting epoxy resins and method for producing insulation systems for electronic engineering 亨斯迈先进材料许可(瑞士)有限公司 2020-11-24 CN claimed
EP-1978049-A1 Curable Epoxy Resin Composition ABB Research Ltd (CH) 2008-10-08 EP claimed
US-7214410-B2 Process for selecting solvents for forming films of ferroelectric polymers SHIPLEY COMPANY, L.L.C. (US) 2007-05-08 US claimed
US-6617483-B1 Extractive distillation for separating a mixture of hydrocarbons with an alkylene glycol and a compatibility agent having polar parameters and hydrogen bonding parameters that result in improved separation GAYLORD CHEMICAL CORPORATION 2003-09-09 US claimed
US-5250638-A Complexes less reactive than imidazole alone; extends pot life TEXACO CHEMICAL COMPANY (US) 1993-10-05 US claimed
EP-0525940-A2 Curable epoxy resin compositions TEXACO CHEMICAL COMPANY (US) 1993-02-03 EP claimed
EP-0507426-A1 Process for dissolving polyurethane foams or removing them from substrates TEXACO CHEMICAL COMPANY (US) 1992-10-07 EP claimed
EP-0425100-A2 Salicylate of 1-isopropyl-2-methyl imidazole as an epoxy resin curative TEXACO CHEMICAL COMPANY (US) 1991-05-02 EP claimed
US-5001211-A Salicylate of 1-isopropyl-2-methyl imidazole as an epoxy resin curative TEXACO CHEMICAL COMPANY (US) 1991-03-19 US claimed
EP-0397341-A1 1-Isopropyl-2-methylimidazole as an epoxy resin curative TEXACO DEVELOPMENT CORPORATION (US) 1990-11-14 EP claimed
US-4931528-A 1-isopropyl-2-methyl imidazole as an epoxy resin curative TEXACO CHEMICAL COMPANY (US) 1990-06-05 US claimed