⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Oxalic Acid SCHEMBL10364074 | 0.89 | CYP26A1 (0.38) | — | |
| SCHEMBL273629 | 0.81 | — | — | |
| SCHEMBL26111243 | 0.79 | ALDH1A1 (0.36) | — | |
| Iodide SCHEMBL5531813 | 0.79 | ALDH1A1 (0.36) | — | |
| SCHEMBL24243580 | 0.77 | — | — | |
| SCHEMBL9210148 | 0.77 | — | — | |
| SCHEMBL28035566 | 0.77 | — | — | |
| SCHEMBL15917807 | 0.77 | — | — | |
| SCHEMBL1984395 | 0.77 | ALDH1A1 (0.40) | — | |
| SCHEMBL10363728 | 0.76 | SMN1; SMN2 (0.39) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 808 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-120484446-B | Resin glue solution for copper-clad plate, high heat-resistant copper-clad plate and preparation method | 俊萱新材料(杭州)有限公司 | 2026-05-19 | — | — | CN | claimed |
| CN-120137346-A | Light-transmitting composite material with ultraviolet shielding function and preparation method and application thereof | 华南理工大学 | 2025-06-13 | — | — | CN | claimed |
| CN-120059650-A | Detachable heat-conducting epoxy structural adhesive, preparation method thereof and application thereof in new energy battery | 华南理工大学 | 2025-05-30 | — | — | CN | claimed |
| CN-120040721-A | Preparation method of bio-based phenolic epoxy resin | 大连理工大学 | 2025-05-27 | — | — | CN | claimed |
| CN-119978317-A | Epoxy resin intrinsic flame retardant material cured by phosphorus-containing imidazole curing agent and preparation method thereof | 广东精英高新材料股份有限公司 | 2025-05-13 | — | — | CN | claimed |
| CN-119931563-A | Liquid epoxy resin composite material repairing adhesive and preparation method thereof | 中国航空制造技术研究院 | 2025-05-06 | — | — | CN | claimed |
| CN-119842046-A | Low-viscosity liquefied dicyandiamide latent curing agent, epoxy resin composition, and preparation method and application thereof | 中国石油化工股份有限公司 | 2025-04-18 | — | — | CN | claimed |
| US-20250102099-A1 | LONG POT LIFE CURABLE EPOXY SYSTEM FOR CURED-IN-PLACE PIPE REHABILITATION PROCESS | BLUE CUBE IP LLC | 2025-03-27 | — | — | US | claimed |
| CN-118956099-B | High-reflectivity flame-retardant resin composition, prepreg and laminated board | 广东伊帕思新材料科技有限公司 | 2025-03-25 | — | — | CN | claimed |
| CN-115678205-B | Glue solution for copper-clad plate and preparation method of copper-clad plate | 安徽鸿海新材料股份有限公司 | 2025-01-28 | — | — | CN | claimed |
| EP-1602678-A1 | Cure accelerators | Hexcel Composites Limited (GB) | 2005-12-07 | — | — | EP | claimed |
| EP-0858725-B1 | MULTILAYER PRINTED CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME | SUMITOMO BAKELITE CO (JP) | 2000-07-05 | — | — | EP | claimed |
| EP-0867480-A2 | Cationically electrodepositable coating composition | KANSAI PAINT CO., LTD. (JP) | 1998-09-30 | — | — | EP | claimed |
| EP-0858725-A1 | MULTILAYER PRINTED CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME | Sumitomo Bakelite Company Limited (JP) | 1998-08-19 | — | — | EP | claimed |
| US-5756190-A | NOVOLAK EPOXY RESIN, CURING AGENT, DILUENT, PHOTOPOLYMERIZATION CATALYST | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1998-05-26 | — | — | US | claimed |
| WO-1997016948-A1 | MULTILAYER PRINTED CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1997-05-09 | — | — | WO | claimed |
| US-5244939-A | Improved adhesion | SOMAR CORPORATION (JP) | 1993-09-14 | — | — | US | claimed |
| EP-0454027-A2 | Adhesive for inner lining hose of water tube | SUNSTAR GIKEN KABUSHIKI KAISHA (JP) | 1991-10-30 | — | — | EP | claimed |
| EP-0239246-B1 | NOVEL IMIDAZOLE COMPOUNDS, PROCESS FOR SYNTHESIS THEREOF, AND METHOD OF CURING EPOXY RESINS USING SAID COMPOUNDS | SHIKOKU CHEMICALS CORPORATION (JP) | 1990-05-16 | — | — | EP | claimed |
| EP-0239246-A1 | Novel imidazole compounds, process for synthesis thereof, and method of curing epoxy resins using said compounds | SHIKOKU CHEMICALS CORPORATION (JP) | 1987-09-30 | — | — | EP | claimed |