Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TRPA1 | O75762 | 2/20 | 0.94 |
| ▸ | ATM | Q13315 | 2/20 | 0.94 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.52 |
| ▸ | HSD17B10 | Q99714 | 5/20 | 0.46 |
| ▸ | MAPT | P10636 | 3/20 | 0.46 |
| ▸ | TP53 | P04637 | 2/20 | 0.46 |
| ▸ | GAA | P10253 | 2/20 | 0.46 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.46 |
| ▸ | GABRA1 | P14867 | 1/20 | 0.44 |
| ▸ | GABRB2 | P47870 | 1/20 | 0.44 |
| ▸ | LMNA | P02545 | 4/20 | 0.44 |
| ▸ | TSHR | P16473 | 4/20 | 0.44 |
| ▸ | NPC1 | O15118 | 2/20 | 0.44 |
| ▸ | RAB9A | P51151 | 2/20 | 0.44 |
| ▸ | HTT | P42858 | 2/20 | 0.44 |
| ▸ | TDP1 | Q9NUW8 | 4/20 | 0.43 |
| ▸ | CA2 | P00918 | 3/20 | 0.43 |
| ▸ | HPGD | P15428 | 3/20 | 0.43 |
| ▸ | EGFR | P00533 | 2/20 | 0.43 |
| ▸ | FYN | P06241 | 2/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ethane SCHEMBL730960 | 1.00 | TRPA1 (0.94) | TRPA1ATMALDH1A1HSD17B10MAPT | |
| SCHEMBL29622820 | 0.97 | — | — | |
| SCHEMBL5940935 | 0.97 | TRPA1 (1.00) | TRPA1ATMALDH1A1HSD17B10MAPT | |
| SCHEMBL3498 | 0.97 | — | — | |
| Hydrochloric Acid SCHEMBL7070510 | 0.94 | TRPA1 (0.94) | TRPA1ATMALDH1A1HSD17B10MAPT | |
| SCHEMBL11763667 | 0.94 | TRPA1 (0.94) | TRPA1ATMALDH1A1HSD17B10MAPT | |
| SCHEMBL11303423 | 0.94 | TRPA1 (0.94) | TRPA1ATMALDH1A1HSD17B10MAPT | |
| SCHEMBL11305100 | 0.94 | TRPA1 (0.94) | TRPA1ATMALDH1A1HSD17B10MAPT | |
| Bromide SCHEMBL1732344 | 0.94 | TRPA1 (0.94) | TRPA1ATMALDH1A1HSD17B10MAPT | |
| Hydrogen Sulfide SCHEMBL11763650 | 0.94 | TRPA1 (0.94) | TRPA1ATMALDH1A1HSD17B10MAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 102 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-105658728-A | Biodegradable polyester resin composite and foam obtained therefrom | 乐天精密化学株式会社 | 2016-06-08 | — | — | CN | claimed |
| CN-1088526-C | Photosensitive ink inhibitor composition | NANYA PLASTICS INDUSTRY CO LTD (CN) | 2002-07-31 | — | — | CN | claimed |
| CN-1236115-A | Photosensitive ink inhibitor composition | NANYA PLASTICS INDUSTRY CO LTD (CN) | 1999-11-24 | — | — | CN | claimed |
| CN-105683836-B | Photosensitive heat curing resin combination and flexible printed circuit board | 太阳油墨制造株式会社 | 2019-11-08 | — | — | CN | disclosed |
| CN-104977806-B | Photosensitive polymer combination, dry film, solidfied material and printed circuit board | 太阳油墨制造株式会社 | 2019-11-08 | — | — | CN | disclosed |
| CN-105093828-B | Hardening resin composition, dry film and printed circuit board | 太阳油墨制造株式会社 | 2019-11-05 | — | — | CN | disclosed |
| CN-109957283-A | High flame retardant solder mask | 江苏艾森半导体材料股份有限公司 | 2019-07-02 | — | — | CN | disclosed |
| CN-109957284-A | Alkali development light heat dual curing solder mask | 江苏艾森半导体材料股份有限公司 | 2019-07-02 | — | — | CN | disclosed |
| CN-109943143-A | Alkali development light heat dual curing solder mask | 江苏艾森半导体材料股份有限公司 | 2019-06-28 | — | — | CN | disclosed |
| CN-109897448-A | The dumb light solder mask of low inorganic constituents | 江苏艾森半导体材料股份有限公司 | 2019-06-18 | — | — | CN | disclosed |
| CN-109868005-A | Light heat dual curing solder mask and its application method with high adhesion force | 江苏艾森半导体材料股份有限公司 | 2019-06-11 | — | — | CN | disclosed |
| CN-1908063-A | High dielectric organic/inorganic hybrid material composition having flexibility and high heat resistance and cured product thereof | IND TECH RES INST (CN) | 2007-02-07 | — | — | CN | disclosed |
| CN-1267478-C | Heat-curable resin composition | VANTICO AG (CH) | 2006-08-02 | — | — | CN | disclosed |
| CN-1599770-A | Heat-curable resin composition | VANTICO AG (CH) | 2005-03-23 | — | — | CN | disclosed |
| CN-1193056-C | Polynuclear epoxy compound, resin obtained therefrom curable with actinic energy ray, and photocurable/thermosetting resin composition containing the same | TAIYO INK MFG CO LTD (JP) | 2005-03-16 | — | — | CN | disclosed |
| CN-1498236-A | Active energy ray-curable resin and photocurable/thermosetting resin composition containing the same | 太阳油墨制造株式会社 | 2004-05-19 | — | — | CN | disclosed |
| CN-1472253-A | Optical solidifying-thermo solidifying resin composition and its solidified products | 太阳油墨制造株式会社 | 2004-02-04 | — | — | CN | disclosed |
| CN-1396937-A | Polynuclear epoxy compound, resin obtained therefrom curable with actinic energy ray, and photocurable/thermosetting resin composition containing the same | TAIYO INK MFG CO LTD (JP) | 2003-02-12 | — | — | CN | disclosed |
| CN-1088526-C | Photosensitive ink inhibitor composition | NANYA PLASTICS INDUSTRY CO LTD (CN) | 2002-07-31 | — | — | CN | disclosed |
| CN-1236115-A | Photosensitive ink inhibitor composition | NANYA PLASTICS INDUSTRY CO LTD (CN) | 1999-11-24 | — | — | CN | disclosed |