Phenol

Phenol

SCHEMBL27435926

CC(=O)O.N=C(N)N.Oc1ccccc1

nearest known ligand 0.52

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

ADRA2AADRA2BADRA2CADRB2AGTR1AVPR1AAVPR1BAVPR2BDKRB2CALCRCHRNA3CHRNB4ESR1ESR2GHSRGNRHRGSC1HSPA8MALT1MC1RMC4RNOS1NOS2NOS3OPRK1OXTRRAMP1RAMP2RAMP3SCN5ASSTR1SSTR2SSTR3SSTR4SSTR5dacAdacBdacCfolPftsImrcAmrcBmrdArplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO

The experimentally established mechanism targets of Phenol. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 known ✓ P03372 2/20 0.40
NOS3 known ✓ P29474 1/20 0.39
NOS1 known ✓ P29475 1/20 0.39
TDP1 Q9NUW8 2/20 0.52
CA12 O43570 1/20 0.52
CA1 P00915 1/20 0.52
CA2 P00918 1/20 0.52
GLA P06280 1/20 0.52
CA3 P07451 1/20 0.52
CA4 P22748 1/20 0.52
CA9 Q16790 1/20 0.52
CA14 Q9ULX7 1/20 0.52
NQO2 P16083 5/20 0.44
CES2 O00748 2/20 0.43
BLM P54132 2/20 0.42
CYP3A4 P08684 2/20 0.42
PARP1 P09874 2/20 0.42
MAPT P10636 2/20 0.42
TSHR P16473 2/20 0.42
RECQL P46063 2/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydroquinone SCHEMBL27257812 0.90 LMNA (0.50) CA12CA1CA2CA3CA4
Parachlorophenol SCHEMBL27389089 0.88 MAPK1 (0.47) TDP1CA12CA1CA2GLA
Phenol SCHEMBL28833788 0.87 TDP1 (0.61) TDP1CA12CA1CA2GLA
Phenol SCHEMBL5934375 0.87 TDP1 (0.61) TDP1CA12CA1CA2GLA
Phenol SCHEMBL29392457 0.87 CA12 (0.69) TDP1CA12CA1CA2GLA
Phenol SCHEMBL11206985 0.87 CA12 (0.69) TDP1CA12CA1CA2GLA
Phenol SCHEMBL10886697 0.87 CA12 (0.69) TDP1CA12CA1CA2GLA
Phenol SCHEMBL10433598 0.87 CA12 (0.69) TDP1CA12CA1CA2GLA
Phenol SCHEMBL478255 0.87 CA12 (0.69) TDP1CA12CA1CA2GLA
Phenol SCHEMBL9331064 0.87 CA12 (0.69) TDP1CA12CA1CA2GLA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 68 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105765383-A SALIVARY BIOMARKER FOR CANCER, METHOD AND DEVICE FOR ASSAYING SAME, AND METHOD FOR DETERMINING SALIVARY BIOMARKER FOR CANCER 唾液科技有限公司 2016-07-13 CN claimed
CN-101759634-B Composite method for cefpiramide midbody D-alpha-(4-Hydroxy-6-methylnicotinamido) hydroxyphenylacetic acid SHANDONG ZHONGCHENG PHARMACEUTICAL CO LTD 2011-02-16 CN claimed
CN-101293868-B Process for synthesizing D-alpha-(6-methyl-4-hydroxyl nicotinamide base)p-hydroxyphenylacetic acid QILU ANTIBIOTICS PHARMACEUTICA CO LTD 2010-11-10 CN claimed
CN-101759634-A Composite method for cefpiramide midbody D-alpha-(4-Hydroxy-6-methylnicotinamido) hydroxyphenylacetic acid SHANDONG ZHONGCHENG PHARMACEUT 2010-06-30 CN claimed
CN-106574163-B Temporary bonding adhesive, adhesive layer, wafer processed body, method for manufacturing semiconductor device using same, polyimide copolymer, polyimide hybrid resin, and resin composition 东丽株式会社 2019-12-03 CN disclosed
CN-109996646-A Scaling powder and soldering paste 千住金属工业株式会社 2019-07-09 CN disclosed
CN-109746591-A Scaling powder and soldering paste 千住金属工业株式会社 2019-05-14 CN disclosed
CN-108885399-A Negative light-sensitive resin combination, cured film, the display device and its manufacturing method for having cured film 东丽株式会社 2018-11-23 CN disclosed
CN-105492534-B Polyurethane resin composition, and adhesive composition, laminate, and printed wiring board using same 东洋纺株式会社 2018-09-21 CN disclosed
CN-106029744-B Polyimide resin, resin combination and stacked film using it 东丽株式会社 2018-08-28 CN disclosed
CN-108138013-A Temporary adhesion laminate film uses the substrate processome of temporary adhesion laminate film and the manufacturing method of multilayer board processome and the manufacturing method using their semiconductor devices 东丽株式会社 2018-06-08 CN disclosed
CN-104662097-B Resin combination, cured film, the manufacturing method of laminate film and semiconductor devices 东丽株式会社 2018-06-05 CN disclosed
CN-1746255-A Polishing compound and method for polishing substrate HITACHI CHEMICAL CO LTD (JP) 2006-03-15 CN disclosed
CN-1646592-A Unsaturated group-containing multi-branched compound, curable composition containing same, and cured product thereof TAIYO INK MFG CO LTD (JP) 2005-07-27 CN disclosed
CN-1615295-A Compounds for the treatment of inflammation, diabetes and related disorders THERACOS INC (US) 2005-05-11 CN disclosed
CN-1457506-A Polishing agent and method for polishing substrate HITACHI CHEMICAL CO LTD (JP) 2003-11-19 CN disclosed
CN-1105724-C Clavulanic acid extractim process SMITHKLINE BEECHAM PLC (GB) 2003-04-16 CN disclosed
CN-1258298-A Process for preparation of metal salt of clavulanic acid SMITHKLINE BEECHAM PLC (GB) 2000-06-28 CN disclosed
CN-1246875-A Aqueous binding agent dispersion for cationic electro-dipcoat paint BASF COATINGS AG (DE) 2000-03-08 CN disclosed
CN-1179161-A Clavulanic acid extractim process SMITHKLINE BEECHAM PLC (GB) 1998-04-15 CN disclosed