Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SRD5A2 | P31213 | 3/20 | 0.53 |
| ▸ | TTR | P02766 | 2/20 | 0.51 |
| ▸ | EGFR | P00533 | 2/20 | 0.51 |
| ▸ | MAP4K4 | O95819 | 1/20 | 0.49 |
| ▸ | RXRA | P19793 | 2/20 | 0.48 |
| ▸ | RXRB | P28702 | 2/20 | 0.48 |
| ▸ | FEN1 | P39748 | 1/20 | 0.47 |
| ▸ | CAMKK2 | Q96RR4 | 1/20 | 0.47 |
| ▸ | RARA | P10276 | 1/20 | 0.47 |
| ▸ | RARB | P10826 | 1/20 | 0.47 |
| ▸ | RARG | P13631 | 1/20 | 0.47 |
| ▸ | PPARG | P37231 | 1/20 | 0.46 |
| ▸ | PPARD | Q03181 | 1/20 | 0.46 |
| ▸ | PPARA | Q07869 | 1/20 | 0.46 |
| ▸ | GSTP1 | P09211 | 1/20 | 0.46 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29964327 | 1.00 | SRD5A2 (0.53) | SRD5A2TTREGFRMAP4K4RXRA | |
| SCHEMBL29963819 | 0.93 | SRD5A2 (0.53) | SRD5A2TTRRXRARXRBCAMKK2 | |
| SCHEMBL5042761 | 0.93 | SRD5A2 (0.53) | SRD5A2TTRRXRARXRBCAMKK2 | |
| SCHEMBL5048542 | 0.89 | AKR1C3 (0.63) | TTRPPARGPPARDPPARA | |
| SCHEMBL21178077 | 0.88 | EGFR (0.64) | SRD5A2TTREGFRRXRARXRB | |
| SCHEMBL21178076 | 0.86 | NCOA1 (0.58) | SRD5A2TTREGFRRXRARXRB | |
| SCHEMBL9211542 | 0.86 | GSTP1 (0.56) | TTRGSTP1 | |
| SCHEMBL30856488 | 0.84 | SRD5A2 (0.59) | SRD5A2TTRRXRARXRBFEN1 | |
| SCHEMBL11419154 | 0.84 | SRD5A2 (0.71) | SRD5A2EGFRRXRARXRB | |
| SCHEMBL5038711 | 0.83 | EGFR (0.55) | SRD5A2TTREGFRRXRARXRB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240043619-A1 | POLYIMIDE PRECURSOR RESIN COMPOSITION | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-02-08 | — | — | US | disclosed |
| US-20210246268-A1 | SILICON-CONTAINING COMPOUND | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-08-12 | — | — | US | disclosed |
| EP-3786213-A1 | SILICON-CONTAINING COMPOUND | Shin-Etsu Chemical Co., Ltd. (JP) | 2021-03-03 | — | — | EP | disclosed |
| US-20190352463-A1 | POLYIMIDE PRECURSOR RESIN COMPOSITION | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2019-11-21 | — | — | US | disclosed |
| US-20170165879-A1 | RESIN PRECURSOR, RESIN COMPOSITION CONTAINING SAME, POLYIMIDE RESIN MEMBRANE, RESIN FILM, AND METHOD FOR PRODUCING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2017-06-15 | — | — | US | disclosed |
| US-8337982-B2 | Comprising first repeating unit obtained by reaction of bisaminophenol compound and dicarboxylic acid, at least one of which has diamondoid structure and second repeating unit obtained by reaction of bisaminophenol compound having no diamondoid structure and dicarboxylic acid; heat resistance | SUMITOMO BAKELITE CO., LTD. (JP) | 2012-12-25 | — | — | US | disclosed |
| US-8178631-B2 | Resin composition, varnish, resin film and semiconductor device | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2012-05-15 | — | — | US | disclosed |
| US-7608928-B2 | Laminated body and semiconductor device | JSR CORPORATION (JP) | 2009-10-27 | — | — | US | disclosed |
| US-20090214860-A1 | Resin Composition, Varnish, Resin Film and Semiconductor Device | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2009-08-27 | — | — | US | disclosed |
| US-20080206548-A1 | Benzoxazole Resin Precursor, Polybenzoxazole Resin, Resin Film And Semiconductor Device | SUMITOMO BAKELITE CO., LTD (JP) | 2008-08-28 | — | — | US | disclosed |
| US-20070154843-A1 | Resin and resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2007-07-05 | — | — | US | disclosed |
| EP-1760774-A1 | LAMINATED BODY AND SEMICONDUCTOR DEVICE | JSR Corporation (JP) | 2007-03-07 | — | — | EP | disclosed |
| EP-1333050-B1 | MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME | SUMITOMO BAKELITE CO (JP) | 2006-12-27 | — | — | EP | disclosed |
| EP-1707588-A1 | RESIN AND RESIN COMPOSITION | Asahi Kasei EMD Corporation (JP) | 2006-10-04 | — | — | EP | disclosed |
| US-7049371-B2 | Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2006-05-23 | — | — | US | disclosed |
| US-20040002572-A1 | Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2004-01-01 | — | — | US | disclosed |
| EP-1333050-A1 | MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME | SUMITOMO BAKELITE CO., LTD. (JP) | 2003-08-06 | — | — | EP | disclosed |
| EP-1327653-A1 | HEAT-RESISTANT RESIN PRECURSOR, HEAT-RESISTANT RESIN AND INSULATING FILM AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2003-07-16 | — | — | EP | disclosed |
| US-6518390-B2 | Polybenzoxazole and crosslinking agent | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2003-02-11 | — | — | US | disclosed |
| US-20020013443-A1 | Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device | SUMITOMO BAKELITE CO., LTD. (JP) | 2002-01-31 | — | — | US | disclosed |