Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | EGFR | P00533 | 1/20 | 0.55 |
| ▸ | SRD5A2 | P31213 | 3/20 | 0.54 |
| ▸ | AKR1C3 | P42330 | 1/20 | 0.54 |
| ▸ | RXRA | P19793 | 2/20 | 0.52 |
| ▸ | RXRB | P28702 | 2/20 | 0.52 |
| ▸ | GSTP1 | P09211 | 1/20 | 0.51 |
| ▸ | FFAR1 | O14842 | 1/20 | 0.50 |
| ▸ | FFAR4 | Q5NUL3 | 1/20 | 0.50 |
| ▸ | PTGES | O14684 | 1/20 | 0.49 |
| ▸ | ALOX5 | P09917 | 1/20 | 0.49 |
| ▸ | TTR | P02766 | 1/20 | 0.49 |
| ▸ | FEN1 | P39748 | 1/20 | 0.48 |
| ▸ | CAMKK2 | Q96RR4 | 1/20 | 0.48 |
| ▸ | IP6K1 | Q92551 | 1/20 | 0.48 |
| ▸ | IP6K3 | Q96PC2 | 1/20 | 0.48 |
| ▸ | IP6K2 | Q9UHH9 | 1/20 | 0.48 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL21178077 | 0.91 | EGFR (0.64) | EGFRSRD5A2RXRARXRBTTR | |
| SCHEMBL5042761 | 0.90 | SRD5A2 (0.53) | SRD5A2AKR1C3RXRARXRBGSTP1 | |
| SCHEMBL29963819 | 0.90 | SRD5A2 (0.53) | SRD5A2AKR1C3RXRARXRBGSTP1 | |
| SCHEMBL29964068 | 0.90 | AKR1C3 (0.64) | EGFRAKR1C3 | |
| SCHEMBL5043190 | 0.90 | AKR1C3 (0.64) | EGFRAKR1C3 | |
| SCHEMBL5038677 | 0.87 | RXRA (0.67) | SRD5A2AKR1C3RXRARXRBFFAR1 | |
| SCHEMBL30705228 | 0.87 | RXRA (0.67) | SRD5A2AKR1C3RXRARXRBFFAR1 | |
| SCHEMBL5042492 | 0.87 | SRD5A2 (0.65) | SRD5A2AKR1C3RXRARXRBFFAR1 | |
| SCHEMBL29963803 | 0.87 | SRD5A2 (0.65) | SRD5A2AKR1C3RXRARXRBFFAR1 | |
| SCHEMBL21179471 | 0.86 | AKR1C3 (0.61) | EGFRAKR1C3RXRARXRBTTR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240043619-A1 | POLYIMIDE PRECURSOR RESIN COMPOSITION | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-02-08 | — | — | US | disclosed |
| WO-2022211086-A1 | POLYIMIDE, RESIN COMPOSITION, POLYIMIDE FILM, AND PRODUCTION METHOD THEREFOR | 旭化成株式会社 | 2022-10-06 | — | — | WO | disclosed |
| US-20210246268-A1 | SILICON-CONTAINING COMPOUND | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-08-12 | — | — | US | disclosed |
| EP-3786213-A1 | SILICON-CONTAINING COMPOUND | Shin-Etsu Chemical Co., Ltd. (JP) | 2021-03-03 | — | — | EP | disclosed |
| US-20190352463-A1 | POLYIMIDE PRECURSOR RESIN COMPOSITION | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2019-11-21 | — | — | US | disclosed |
| US-20170165879-A1 | RESIN PRECURSOR, RESIN COMPOSITION CONTAINING SAME, POLYIMIDE RESIN MEMBRANE, RESIN FILM, AND METHOD FOR PRODUCING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2017-06-15 | — | — | US | disclosed |
| US-7416822-B2 | Resin and resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2008-08-26 | — | — | US | disclosed |
| US-20070154843-A1 | Resin and resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2007-07-05 | — | — | US | disclosed |
| EP-1333050-B1 | MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME | SUMITOMO BAKELITE CO (JP) | 2006-12-27 | — | — | EP | disclosed |
| EP-1707588-A1 | RESIN AND RESIN COMPOSITION | Asahi Kasei EMD Corporation (JP) | 2006-10-04 | — | — | EP | disclosed |
| US-7049371-B2 | Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2006-05-23 | — | — | US | disclosed |
| US-20040002572-A1 | Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2004-01-01 | — | — | US | disclosed |
| EP-1333050-A1 | MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME | SUMITOMO BAKELITE CO., LTD. (JP) | 2003-08-06 | — | — | EP | disclosed |
| EP-1327653-A1 | HEAT-RESISTANT RESIN PRECURSOR, HEAT-RESISTANT RESIN AND INSULATING FILM AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2003-07-16 | — | — | EP | disclosed |
| US-6518390-B2 | Polybenzoxazole and crosslinking agent | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2003-02-11 | — | — | US | disclosed |
| US-20020013443-A1 | Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device | SUMITOMO BAKELITE CO., LTD. (JP) | 2002-01-31 | — | — | US | disclosed |