SCHEMBL30856488

SCHEMBL30856488

O=C(O)c1ccc(Oc2ccccc2-c2ccc(Oc3ccc(-c4ccccc4Oc4ccc(C(=O)O)cc4)cc3)cc2)cc1

nearest known ligand 0.59

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
SRD5A2 P31213 3/20 0.59
FEN1 P39748 2/20 0.57
CAMKK2 Q96RR4 1/20 0.57
FFAR4 Q5NUL3 1/20 0.57
NCOA1 Q15788 1/20 0.56
NCOA3 Q9Y6Q9 1/20 0.56
RXRA P19793 1/20 0.55
RXRB P28702 1/20 0.55
RXRG P48443 1/20 0.55
PTGS2 P35354 1/20 0.53
PARP10 Q53GL7 2/20 0.51
PARP15 Q460N3 1/20 0.51
TTR P02766 1/20 0.49
GSTP1 P09211 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30856503 0.98 FFAR4 (0.58) SRD5A2FEN1CAMKK2FFAR4NCOA1
SCHEMBL21178076 0.95 NCOA1 (0.58) SRD5A2FEN1CAMKK2FFAR4NCOA1
SCHEMBL4326298 0.95 NCOA1 (0.62) SRD5A2FEN1CAMKK2FFAR4NCOA1
SCHEMBL9422294 0.90 SRD5A2 (0.61) SRD5A2FEN1CAMKK2NCOA1NCOA3
SCHEMBL2710776 0.88 SRD5A2 (0.65) SRD5A2RXRARXRBRXRGPARP10
SCHEMBL2710772 0.88 SRD5A2 (0.59) SRD5A2FEN1CAMKK2NCOA1NCOA3
SCHEMBL25343498 0.87 CYP2C8 (0.53) SRD5A2FEN1CAMKK2FFAR4NCOA1
SCHEMBL258244 0.87 FEN1 (0.50) SRD5A2FEN1CAMKK2FFAR4NCOA1
SCHEMBL30519278 0.87 CYP2C8 (0.53) SRD5A2FEN1CAMKK2FFAR4NCOA1
SCHEMBL5669722 0.85 FEN1 (0.48) SRD5A2FEN1CAMKK2FFAR4NCOA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527101-B Novel compound, polymer, process for producing the same, photosensitive resin composition, pattern forming process, cured film, and electronic component 信越化学工业株式会社 2024-04-23 CN disclosed