SCHEMBL2750422

SCHEMBL2750422

O=C(CCl)OC(=O)CCC(=O)OC(=O)CCl

nearest known ligand 0.48

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.48
TSHR P16473 2/20 0.38
PRSS1 P07477 1/20 0.34
CTSG P08311 1/20 0.34
CTRB1 P17538 1/20 0.34
CMA1 P23946 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16026 0.90
SCHEMBL510001 0.88 TSHR (0.43) ALDH1A1TSHRPRSS1CTSGCTRB1
SCHEMBL27705406 0.87 TSHR (0.41) ALDH1A1TSHR
SCHEMBL27713192 0.87 TSHR (0.41) ALDH1A1TSHR
SCHEMBL4646785 0.84 ALDH1A1 (0.40) ALDH1A1TSHRPRSS1CTSGCTRB1
SCHEMBL4708023 0.84 ALDH1A1 (0.75) ALDH1A1TSHR
SCHEMBL28498302 0.83 KDM4E (0.52) ALDH1A1
SCHEMBL11219823 0.82 ALDH1A1 (0.43) ALDH1A1TSHRPRSS1CTSGCTRB1
SCHEMBL942008 0.82 ALDH1A1 (0.34) ALDH1A1
Sulfur Dioxide SCHEMBL28841867 0.81 TSHR (0.37) ALDH1A1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115667400-B Composition, method for preparing same, and articles made therefrom 高新特殊工程塑料全球技术有限公司 2024-05-24 CN disclosed
CN-115667400-A Compositions, methods for making the same, and articles made therefrom 高新特殊工程塑料全球技术有限公司 2023-01-31 CN disclosed
CN-104583474-B Polyamide-polyphenylene ether fibers, articles, compositions, and methods 沙特基础全球技术有限公司 2018-11-23 CN disclosed
EP-3017006-B1 CONDUCTIVE POLYAMIDE COMPOSITION AND ARTICLE SABIC GLOBAL TECHNOLOGIES BV (NL) 2018-05-02 EP disclosed
CN-105392840-B Mechanograph and the composition used in its manufacture 沙特基础全球技术有限公司 2017-08-25 CN disclosed
US-9650084-B2 Conductive polyamide composition and article SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2017-05-16 US disclosed
EP-3017006-A1 CONDUCTIVE POLYAMIDE COMPOSITION AND ARTICLE SABIC Global Technologies B.V. (NL) 2016-05-11 EP disclosed
US-20160107705-A1 CONDUCTIVE POLYAMIDE COMPOSITION AND ARTICLE SHPP GLOBAL TECHNOLOGIES B.V. (NL) 2016-04-21 US disclosed
CN-103842566-B The method of polyamide/polyphenylether fibre and formation fiber SABIC INNOVATIVE PLASTICS IP B.V. (NL) 2015-11-25 CN disclosed
US-20150183991-A1 FLAME-RETARDANT THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE OF THE SAME ASAHI KASEI CHEMICALS CORPORATION (JP) 2015-07-02 US disclosed
CN-1420911-A Conductive polyphenylene ether-polyamide blend GEN ELECTRIC (US) 2003-05-28 CN disclosed
EP-1125985-B1 Polyamide composition ASAHI CHEMICAL IND (JP) 2003-05-02 EP disclosed
US-20010031831-A1 Polyamide composition ASAHI KASEI KABUSHIKI KAISHA (JP) 2001-10-18 US disclosed
EP-1125985-A1 Polyamide composition Asahi Kasei Kabushiki Kaisha (JP) 2001-08-22 EP disclosed
US-5260374-A Polyphenylene ether polyamide blends GENERAL ELECTRIC COMPANY (US) 1993-11-09 US disclosed
US-5206281-A Blend of polyphenylene ether, propylene polymer, rubber and filler; molding material SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1993-04-27 US disclosed
US-5132365-A Compatibilizing Agent, Vinylaromatic Modifier Resin GENERAL ELECTRIC CO. (US) 1992-07-21 US disclosed
EP-0403056-A2 Thermoplastic resin composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1990-12-19 EP disclosed
EP-0302897-A1 POLYPHENYLENE ETHER POLYAMIDE BLENDS GENERAL ELECTRIC COMPANY (US) 1989-02-15 EP disclosed
WO-1988006173-A1 POLYPHENYLENE ETHER POLYAMIDE BLENDS GENERAL ELECTRIC COMPANY (US) 1988-08-25 WO disclosed