SCHEMBL275243

SCHEMBL275243

C=C(C)C(=O)OCCNC(=O)OCCCCCCOC(=O)NCCOC(=O)C(=C)C

nearest known ligand 0.61

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.61
ACHE P22303 14/20 0.56
POLB P06746 1/20 0.47
APEX1 P27695 1/20 0.47
HTT P42858 1/20 0.47
TDP1 Q9NUW8 1/20 0.47
THRB P10828 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10057618 1.00 TSHR (0.61) TSHRACHEPOLBAPEX1HTT
SCHEMBL14368843 0.98 TSHR (0.58) TSHRACHEPOLBAPEX1HTT
SCHEMBL23450390 0.95 TSHR (0.56) TSHRACHEPOLBAPEX1HTT
SCHEMBL10057616 0.95 TSHR (0.53) TSHRACHEPOLBAPEX1HTT
SCHEMBL10287427 0.94 TSHR (0.73) TSHRACHE
SCHEMBL8029896 0.94 TSHR (0.73) TSHRACHE
SCHEMBL13032964 0.94 TSHR (0.73) TSHRACHE
SCHEMBL21404711 0.94 ACHE (0.60) TSHRACHEPOLBAPEX1HTT
SCHEMBL21404698 0.94 ACHE (0.60) TSHRACHEPOLBAPEX1HTT
SCHEMBL13714882 0.94 TSHR (0.73) TSHRACHE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2085220-B1 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate and method of producing the same FUJIFILM CORP (JP) 2015-05-20 EP disclosed
US-8822126-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM CORPORATION (JP) 2014-09-02 US disclosed
US-8822126-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM CORPORATION (JP) 2014-09-02 US disclosed
US-8669040-B2 Method of manufacturing relief printing plate and printing plate precursor for laser engraving FUJIFILM CORPORATION (JP) 2014-03-11 US disclosed
US-8669040-B2 Method of manufacturing relief printing plate and printing plate precursor for laser engraving FUJIFILM CORPORATION (JP) 2014-03-11 US disclosed
EP-2106906-B1 Relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM CORP (JP) 2013-08-14 EP disclosed
US-8389198-B2 Resin composition for laser engraving, resin printing plate precursor for laser engraving, relief printing plate and method for production of relief printing plate FUJIFILM CORPORATION (JP) 2013-03-05 US disclosed
US-8389198-B2 Resin composition for laser engraving, resin printing plate precursor for laser engraving, relief printing plate and method for production of relief printing plate FUJIFILM CORPORATION (JP) 2013-03-05 US disclosed
US-8361702-B2 Resin composition for laser engraving, resin printing plate precursor for laser engraving, relief printing plate and method for production of relief printing plate FUJIFILM CORPORATION (JP) 2013-01-29 US disclosed
US-8361702-B2 Resin composition for laser engraving, resin printing plate precursor for laser engraving, relief printing plate and method for production of relief printing plate FUJIFILM CORPORATION (JP) 2013-01-29 US disclosed
US-20090123712-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RESIN PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCTION OF RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-05-14 US disclosed
US-20090123712-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RESIN PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCTION OF RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-05-14 US disclosed
US-7531291-B2 heat-decomposable cured polyurethane having an aromatic group is directly connected to a urethane bond; high sensitivity to easily form a pattern FUJIFILM CORPORATION (JP) 2009-05-12 US disclosed
US-7531291-B2 heat-decomposable cured polyurethane having an aromatic group is directly connected to a urethane bond; high sensitivity to easily form a pattern FUJIFILM CORPORATION (JP) 2009-05-12 US disclosed
US-20090099320-A1 LASER-DECOMPOSABLE RESIN COMPOSITION AND LASER-DECOMPOSABLE PATTERN-FORMING MATERIAL AND FLEXOGRAPHIC PRINTING PLATE PRECURSOR OF LASER ENGRAVING TYPE USING THE SAME FUJIFILM CORPORATION (JP) 2009-04-16 US disclosed
US-20090099320-A1 LASER-DECOMPOSABLE RESIN COMPOSITION AND LASER-DECOMPOSABLE PATTERN-FORMING MATERIAL AND FLEXOGRAPHIC PRINTING PLATE PRECURSOR OF LASER ENGRAVING TYPE USING THE SAME FUJIFILM CORPORATION (JP) 2009-04-16 US disclosed
US-20090081414-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RESIN PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCTION OF RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-03-26 US disclosed
US-20090081414-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RESIN PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCTION OF RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-03-26 US disclosed
US-20080057437-A1 heat-decomposable cured polyurethane having an aromatic group is directly connected to a urethane bond; high sensitivity to easily form a pattern FUJIFILM CORPORATION (JP) 2008-03-06 US disclosed
US-20080057437-A1 heat-decomposable cured polyurethane having an aromatic group is directly connected to a urethane bond; high sensitivity to easily form a pattern FUJIFILM CORPORATION (JP) 2008-03-06 US disclosed