SCHEMBL275528

SCHEMBL275528

O=S(=O)(O)c1cc(OCCO)cc(OCCO)c1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.42
RECQL P46063 2/20 0.42
CA1 P00915 3/20 0.37
CA2 P00918 2/20 0.37
CA4 P22748 1/20 0.37
GAA P10253 1/20 0.37
CA12 O43570 1/20 0.37
CA9 Q16790 1/20 0.37
LCK P06239 1/20 0.36
FYN P06241 1/20 0.36
SMN1; SMN2 Q16637 4/20 0.36
CYP3A4 P08684 1/20 0.36
ING2 Q9H160 1/20 0.35
NR1I2 O75469 1/20 0.35
GCK P35557 1/20 0.35
ALOX15 P16050 2/20 0.34
TP53 P04637 2/20 0.34
LMNA P02545 3/20 0.33
POLB P06746 2/20 0.33
RAB9A P51151 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1217133 0.80 ALDH1A1 (0.52) ALDH1A1RECQLCA1CA2GAA
SCHEMBL5378158 0.80 ALDH1A1 (0.59) ALDH1A1RECQLCA1GAACA12
SCHEMBL9359723 0.78 ALDH1A1 (0.50) ALDH1A1RECQLCA1CA2GAA
SCHEMBL8381611 0.78 ALDH1A1 (0.50) ALDH1A1RECQLCA1CA2GAA
SCHEMBL9359724 0.78 ALDH1A1 (0.50) ALDH1A1RECQLCA1CA2GAA
SCHEMBL9292434 0.77 CA1 (0.49) ALDH1A1RECQLCA1CA2CA4
SCHEMBL14571064 0.76 CA12 (0.46) ALDH1A1RECQLCA1CA2CA4
SCHEMBL9292547 0.75 CA1 (0.48) ALDH1A1RECQLCA1CA2CA4
SCHEMBL9293398 0.75 CA1 (0.48) ALDH1A1RECQLCA1CA2CA4
SCHEMBL9293217 0.75 CA1 (0.48) ALDH1A1RECQLCA1CA2CA4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8133654-B2 Laser-decomposable resin composition and laser-decomposable pattern-forming material and flexographic printing plate precursor of laser engraving type using the same FUJIFILM CORPORATION (JP) 2012-03-13 US disclosed
US-20100075118-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD OF PRODUCING THE SAME FUJIFILM CORPORATION (JP) 2010-03-25 US disclosed
US-20100068470-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD OF PRODUCING THE SAME FUJIFILM CORPORATION (JP) 2010-03-18 US disclosed
US-20090311494-A1 RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE, AND PROCESS FOR PRODUCING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-12-17 US disclosed
US-20090246653-A1 RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE, AND METHOD OF MANUFACTURING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-10-01 US disclosed
US-7531291-B2 heat-decomposable cured polyurethane having an aromatic group is directly connected to a urethane bond; high sensitivity to easily form a pattern FUJIFILM CORPORATION (JP) 2009-05-12 US disclosed
US-20090099320-A1 LASER-DECOMPOSABLE RESIN COMPOSITION AND LASER-DECOMPOSABLE PATTERN-FORMING MATERIAL AND FLEXOGRAPHIC PRINTING PLATE PRECURSOR OF LASER ENGRAVING TYPE USING THE SAME FUJIFILM CORPORATION (JP) 2009-04-16 US disclosed
US-20080057437-A1 heat-decomposable cured polyurethane having an aromatic group is directly connected to a urethane bond; high sensitivity to easily form a pattern FUJIFILM CORPORATION (JP) 2008-03-06 US disclosed