SCHEMBL27554

SCHEMBL27554

CSc1ccc(C(=O)C(C)(C)N2CCOCC2)cc1

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 1.00
MAPK1 P28482 3/20 1.00
SMN1; SMN2 Q16637 3/20 1.00
TSHR P16473 2/20 1.00
HRH3 Q9Y5N1 1/20 0.46
MEN1 O00255 3/20 0.41
KMT2A Q03164 3/20 0.41
KDM4E B2RXH2 3/20 0.41
MAPT P10636 3/20 0.41
PLK1 P53350 1/20 0.40
HTT P42858 1/20 0.39
MLYCD O95822 1/20 0.39
HSP90AA1 P07900 1/20 0.39
HSP90AB1 P08238 1/20 0.39
HSD17B10 Q99714 2/20 0.39
HPGD P15428 1/20 0.39
RAB9A P51151 2/20 0.38
NPC1 O15118 1/20 0.38
LMNA P02545 2/20 0.38
GPR119 Q8TDV5 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14246539 1.00 ALDH1A1 (1.00) ALDH1A1MAPK1SMN1; SMN2TSHRHRH3
Hydrochloric Acid SCHEMBL727298 0.98 ALDH1A1 (0.97) ALDH1A1MAPK1SMN1; SMN2TSHRHRH3
SCHEMBL21824684 0.97 ALDH1A1 (0.94) ALDH1A1MAPK1SMN1; SMN2TSHRHRH3
Formaldehyde SCHEMBL28406090 0.97 ALDH1A1 (0.94) ALDH1A1MAPK1SMN1; SMN2TSHRHRH3
SCHEMBL21081716 0.96 ALDH1A1 (0.92) ALDH1A1MAPK1SMN1; SMN2TSHRHRH3
SCHEMBL28995353 0.94 SMN1; SMN2 (0.89) ALDH1A1MAPK1SMN1; SMN2TSHRHRH3
Formic Acid SCHEMBL28563317 0.94 ALDH1A1 (0.89) ALDH1A1MAPK1SMN1; SMN2TSHRHRH3
SCHEMBL22444356 0.92 ALDH1A1 (0.85) ALDH1A1MAPK1SMN1; SMN2TSHRHRH3
Biphenyl SCHEMBL15988145 0.92 ALDH1A1 (0.85) ALDH1A1MAPK1SMN1; SMN2TSHRHRH3
SCHEMBL30366309 0.90 ALDH1A1 (0.82) ALDH1A1MAPK1SMN1; SMN2TSHRHRH3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 39481 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122079951-A Acid-base strippable diacrylate and preparation method and application thereof 2026-05-26 CN claimed
CN-120617300-B Application of BSP-MA/HA-NB hydrogel in preparation of medicines for treating bone defect, cartilage injury or articular cartilage degenerative diseases Sichuan Orthopaedic Hospital (Chengdu Sports Hospital, Chengdu Sports Trauma Research Institute) (CN) 2026-05-26 CN claimed
CN-122080260-A Environment-friendly insulating paint and preparation method thereof 2026-05-26 CN claimed
CN-122080715-A Raw material composition for preparing acrylic optical coating and raw material composition for preparing acrylic optical lens 2026-05-26 CN claimed
CN-116769433-B Acrylic ester pressure-sensitive adhesive and preparation method and application thereof 昆山石梅新材料科技有限公司 2026-05-19 CN claimed
CN-122060358-A UV (ultraviolet) inkjet glue and preparation method and application thereof 韦尔通科技股份有限公司 2026-05-19 CN claimed
CN-117777165-B Photosensitive polyimide oligomer, preparation method and polyimide photosensitive resin composition prepared from photosensitive polyimide oligomer 信联聚科(上海)新材料有限公司 2026-05-15 CN claimed
CN-122037958-A Liquid crystal composition, liquid crystal phase difference film and preparation method thereof 成都瑞波科材料科技有限公司 2026-05-15 CN claimed
CN-117549213-B Diamond prepreg for grinding pad and preparation method and application thereof 东莞市鼎泰鑫电子有限公司 2026-05-15 CN claimed
US-20260132314-A1 ADHESIVE TAPE ETERNAL MATERIALS CO., LTD. (TW) 2026-05-14 US claimed
US-5100767-A Epoxy resins TAMURA KAKEN CO., LTD. (JP) 1992-03-31 US claimed
EP-0454359-A1 Method of controlling phase separation in polymerisation reactions and products utilising same KOCH INDUSTRIES, INC. (US) 1991-10-30 EP claimed
US-5045435-A Latex of carboxylated acrylate copolymer, photoinitiator, and multilayer acrylated monomer ARMSTRONG WORLD INDUSTRIES, INC. (US) 1991-09-03 US claimed
EP-0414001-A2 Process for the photoinitiative control of inorganic structure formation in the sol-gel process FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. (DE) 1991-02-27 EP claimed
US-4996132-A Heat-resistant photosensitive resin composition TOYKO OHKA KOGYO CO. LTD. (JP) 1991-02-26 US claimed
US-4994703-A Piezoelectric element of laminate type MITSUBISHI KASEI CORPORATION (JP) 1991-02-19 US claimed
US-4902726-A Photosensitive resin composition solution HITACHI CHEMICAL COMPANY, LTD. (JP) 1990-02-20 US claimed
US-4849320-A Method of forming images CIBA-GEIGY CORPORATION (US) 1989-07-18 US claimed
EP-0283990-A2 A heat-resistant photosensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 1988-09-28 EP claimed
EP-0280295-A2 A heat-resistant photosensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 1988-08-31 EP claimed