SCHEMBL30366309

SCHEMBL30366309

[2H]c1cc(SC)ccc1C(=O)C(C)(C)N1CCOCC1

nearest known ligand 0.82

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 7/20 0.82
SMN1; SMN2 Q16637 4/20 0.82
MAPK1 P28482 3/20 0.82
TSHR P16473 2/20 0.82
HRH3 Q9Y5N1 1/20 0.40
HTT P42858 1/20 0.36
KDM4E B2RXH2 4/20 0.36
HSD17B10 Q99714 3/20 0.36
LMNA P02545 2/20 0.36
HPGD P15428 2/20 0.36
MEN1 O00255 3/20 0.36
KMT2A Q03164 3/20 0.36
MAPT P10636 2/20 0.36
PLK1 P53350 1/20 0.36
HSP90AA1 P07900 1/20 0.35
HSP90AB1 P08238 1/20 0.35
USP2 O75604 1/20 0.35
MMP1 P03956 1/20 0.35
MMP2 P08253 1/20 0.35
MMP3 P08254 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27554 0.90 ALDH1A1 (1.00) ALDH1A1SMN1; SMN2MAPK1TSHRHRH3
SCHEMBL14246539 0.90 ALDH1A1 (1.00) ALDH1A1SMN1; SMN2MAPK1TSHRHRH3
SCHEMBL21081716 0.89 ALDH1A1 (0.92) ALDH1A1SMN1; SMN2MAPK1TSHRHRH3
Hydrochloric Acid SCHEMBL727298 0.89 ALDH1A1 (0.97) ALDH1A1SMN1; SMN2MAPK1TSHRHRH3
Formaldehyde SCHEMBL28406090 0.88 ALDH1A1 (0.94) ALDH1A1SMN1; SMN2MAPK1TSHRHRH3
SCHEMBL21824684 0.88 ALDH1A1 (0.94) ALDH1A1SMN1; SMN2MAPK1TSHRHRH3
Formic Acid SCHEMBL28563317 0.85 ALDH1A1 (0.89) ALDH1A1SMN1; SMN2MAPK1TSHRHRH3
SCHEMBL28995353 0.85 SMN1; SMN2 (0.89) ALDH1A1SMN1; SMN2MAPK1TSHRHRH3
SCHEMBL22444356 0.83 ALDH1A1 (0.85) ALDH1A1SMN1; SMN2MAPK1TSHRHRH3
Biphenyl SCHEMBL15988145 0.83 ALDH1A1 (0.85) ALDH1A1SMN1; SMN2MAPK1TSHRHRH3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116057140-B Improvement of surface properties of radiation-cured coatings 毕克化学有限公司 2024-03-19 CN disclosed
CN-111201300-B Ink comprising encapsulated nanoparticles 奈科斯多特股份公司 2024-03-15 CN disclosed
CN-117642292-A Composition for 3D printing, 3D printed object formed therefrom and method of forming the object 巴斯夫欧洲公司 2024-03-01 CN disclosed
CN-110022825-B Absorbent structure 宝洁公司 2024-02-27 CN disclosed
CN-117500656-A System and method for stereolithography three-dimensional printing 霍洛公司 2024-02-02 CN disclosed
CN-117412856-A Articles containing adhesive compositions exhibiting on-demand debonding behavior 3M创新有限公司 2024-01-16 CN disclosed
CN-117355544-A Compositions based on (meth) acrylate monomers 博斯蒂克股份公司 2024-01-05 CN disclosed
CN-117283450-A Porous chemical mechanical polishing pad 应用材料公司 2023-12-26 CN disclosed
CN-117280002-A Radiation curable composition for producing support substructure for 3D photopolymer jetting 巴斯夫欧洲公司 2023-12-22 CN disclosed
CN-117164812-A Functionalized polyurethanes prepared from renewable materials 汉高股份有限及两合公司 2023-12-05 CN disclosed
CN-107922573-B Aqueous polymer composition comprising polyurethane (meth) acrylate 巴斯夫欧洲公司 2023-08-25 CN disclosed
CN-110783071-B Coil array part 株式会社村田制作所 2023-08-15 CN disclosed
CN-116438214-A Sealing material for organic EL display element, cured product thereof, and organic EL display device 三井化学株式会社 2023-07-14 CN disclosed
CN-116370200-A Female pad with barrier cuffs 宝洁公司 2023-07-04 CN disclosed
CN-116370199-A Female pad with barrier cuffs 宝洁公司 2023-07-04 CN disclosed
CN-116348567-A Curable silicone- (meth) acrylate compositions, methods of making and uses thereof 美国陶氏有机硅公司 2023-06-27 CN disclosed
CN-112566753-B Structured abrasive article and method of making the same 3M创新有限公司 2023-06-27 CN disclosed
CN-116323829-A Ink composition for inkjet, cured product thereof, light conversion layer, color filter, and light-emitting element DIC株式会社 2023-06-23 CN disclosed
CN-114730127-B Photosensitive resin composition, photosensitive resin sheet, hollow structure, cured product, method for producing hollow structure, electronic component, and elastic wave filter 东丽株式会社 2023-05-12 CN disclosed
CN-110612086-B Absorbent article having multiple zones 宝洁公司 2023-04-21 CN disclosed