Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PPARA | Q07869 | 6/20 | 0.36 |
| ▸ | PPARG | P37231 | 5/20 | 0.36 |
| ▸ | CA1 | P00915 | 2/20 | 0.35 |
| ▸ | CA2 | P00918 | 2/20 | 0.35 |
| ▸ | CA12 | O43570 | 1/20 | 0.35 |
| ▸ | CA9 | Q16790 | 1/20 | 0.35 |
| ▸ | GABRA1 | P14867 | 2/20 | 0.33 |
| ▸ | GABRG2 | P18507 | 2/20 | 0.33 |
| ▸ | GABRB3 | P28472 | 2/20 | 0.33 |
| ▸ | FAAH | O00519 | 1/20 | 0.32 |
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.32 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.32 |
| ▸ | HPGD | P15428 | 1/20 | 0.32 |
| ▸ | TSHR | P16473 | 1/20 | 0.32 |
| ▸ | GABRB1 | P18505 | 1/20 | 0.32 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.32 |
| ▸ | SLC6A2 | P23975 | 1/20 | 0.32 |
| ▸ | HTR2C | P28335 | 1/20 | 0.32 |
| ▸ | GABRA5 | P31644 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27486541 | 0.86 | CA12 (0.47) | PPARAPPARGCA1CA2CA12 | |
| SCHEMBL3689994 | 0.82 | CA1 (0.46) | PPARAPPARGCA1CA2CA12 | |
| SCHEMBL13366160 | 0.81 | ABL1 (0.47) | PPARAPPARGCA1CA2CA12 | |
| SCHEMBL5075033 | 0.81 | GABRA1 (0.35) | PPARAPPARGCA1CA2GABRA1 | |
| SCHEMBL3627283 | 0.81 | USP7 (0.32) | — | |
| SCHEMBL27943145 | 0.81 | — | — | |
| SCHEMBL3697861 | 0.80 | CA1 (0.44) | PPARAPPARGCA1CA2CA12 | |
| SCHEMBL12648819 | 0.80 | IRAK4 (0.38) | CA1CA2CA12CA9GABRA1 | |
| SCHEMBL29634663 | 0.78 | HSP90AA1 (0.32) | PPARAPPARGHPGDTRPV1AR | |
| SCHEMBL9491323 | 0.75 | FNTA (0.31) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-101967265-B | High-frequency resin composition and high-frequency circuit board manufactured by using same | GUANGDONG SHENGYI SCIENCE AND TECHNOLOGY CO LTD | 2013-03-06 | — | — | CN | claimed |
| CN-102597089-A | Thermosetting resin compositions and articles | PARK ELECTROCHEMICAL CORP | 2012-07-18 | — | — | CN | claimed |
| CN-102504201-A | Epoxy resin composition and high-frequency circuit board manufactured by using same | SHENGYI TECHNOLOGY CO LTD | 2012-06-20 | — | — | CN | claimed |
| CN-101967264-A | Epoxy resin composition and high-frequency circuit board manufactured by using same | GUANGDONG SHENGYI SCIENCE AND TECHNOLOGY CO LTD | 2011-02-09 | — | — | CN | claimed |
| CN-101967265-A | High-frequency resin composition and high-frequency circuit board manufactured by using same | GUANGDONG SHENGYI SCIENCE AND TECHNOLOGY CO LTD | 2011-02-09 | — | — | CN | claimed |
| CN-103709747-B | A kind of compositions of thermosetting resin and application thereof | 广东生益科技股份有限公司 | 2017-01-04 | — | — | CN | disclosed |
| CN-103724945-B | A kind of halogen-free epoxy resin composition and application thereof | 广东生益科技股份有限公司 | 2016-09-07 | — | — | CN | disclosed |
| CN-101967265-B | High-frequency resin composition and high-frequency circuit board manufactured by using same | GUANGDONG SHENGYI SCIENCE AND TECHNOLOGY CO LTD | 2013-03-06 | — | — | CN | disclosed |
| CN-102532483-A | Thermosetting resin compound containing carboxyl modified polyurethane resin | TOYO INK MFG CO | 2012-07-04 | — | — | CN | disclosed |
| CN-102504201-A | Epoxy resin composition and high-frequency circuit board manufactured by using same | SHENGYI TECHNOLOGY CO LTD | 2012-06-20 | — | — | CN | disclosed |
| CN-101492527-B | Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same | HITACHI CHEMICAL CO LTD | 2011-11-09 | — | — | CN | disclosed |
| CN-101528007-B | Adhesion assisting agent-bearing metal foil, printed wiring board using the same and manufacturing method thereof | HITACHI CHEMICAL CO LTD | 2011-04-20 | — | — | CN | disclosed |
| CN-100488766-C | Metal foil with resin attached thereto, metal-clad laminate, printed wiring board using the same, and method for manufacturing the same | HITACHI CHEMICAL CO LTD (JP) | 2009-05-20 | — | — | CN | disclosed |
| CN-101259769-A | Resin coated metal foil, laminate, manufacturing method thereof, and printed wiring board using them | HITACHI CHEMICAL CO LTD (JP) | 2008-09-10 | — | — | CN | disclosed |
| CN-101259768-A | Resin coated metal foil, laminate, manufacturing method thereof, and printed wiring board using them | HITACHI CHEMICAL CO LTD (JP) | 2008-09-10 | — | — | CN | disclosed |
| CN-1962755-A | Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same | HITACHI CHEMICAL CO LTD (JP) | 2007-05-16 | — | — | CN | disclosed |
| CN-1891453-A | Resin coated metal foil, metal-clad laminate, printed wiring board using the same, and its manufacturing process | HITACHI CHEMICAL CO LTD (JP) | 2007-01-10 | — | — | CN | disclosed |
| CN-1684995-A | Resin composition for printed wiring board, and varnish, prepreg and metal-clad laminate using same | HITACHI CHEMICAL CO LTD (JP) | 2005-10-19 | — | — | CN | disclosed |
| CN-1662120-A | Adhesion-assisting agent-bearing metal foil, printed wiring board, and method for producing same | HITACHI CHEMICAL CO LTD (JP) | 2005-08-31 | — | — | CN | disclosed |
| CN-1638957-A | Metal foil with resin attached thereto, metal-clad laminate, printed wiring board using the same, and method for manufacturing the same | HITACHI CHEMICAL CO LTD (JP) | 2005-07-13 | — | — | CN | disclosed |