Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.32 |
| ▸ | HSP90AB1 | P08238 | 1/20 | 0.32 |
| ▸ | PPARA | Q07869 | 2/20 | 0.31 |
| ▸ | AR | P10275 | 1/20 | 0.31 |
| ▸ | PPARG | P37231 | 1/20 | 0.31 |
| ▸ | TRPV1 | Q8NER1 | 1/20 | 0.30 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.30 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.30 |
| ▸ | MAPT | P10636 | 1/20 | 0.30 |
| ▸ | HPGD | P15428 | 1/20 | 0.30 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.30 |
| ▸ | RXFP1 | Q9HBX9 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7204352 | 0.83 | MEN1 (0.35) | PPARAPPARGMAPTHPGDRXFP1 | |
| SCHEMBL27486541 | 0.81 | CA12 (0.47) | PPARAARPPARG | |
| SCHEMBL29134188 | 0.78 | ALOX5 (0.33) | PPARAPPARGALDH1A1MAPTNPSR1 | |
| SCHEMBL27597471 | 0.78 | PPARA (0.36) | PPARAARPPARGTRPV1HPGD | |
| SCHEMBL10439823 | 0.77 | ROCK2 (0.35) | — | |
| SCHEMBL27943145 | 0.76 | — | — | |
| SCHEMBL3627283 | 0.76 | USP7 (0.32) | — | |
| SCHEMBL5075033 | 0.76 | GABRA1 (0.35) | PPARAARPPARGTRPV1HPGD | |
| SCHEMBL9491323 | 0.73 | FNTA (0.31) | — | |
| SCHEMBL29721651 | 0.72 | ALDH1A1 (0.48) | ALDH1A1MAPTHPGD |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110885428-B | Halogen-free thermosetting resin composition, prepreg using same, laminated board and printed circuit board | 广东生益科技股份有限公司 | 2022-06-28 | — | — | CN | claimed |
| EP-4463504-A1 | CAPPED POLY(PHENYLENE ETHER) AND CURABLE THERMOSETTING COMPOSITION COMPRISING THE SAME | SHPP Global Technologies B.V. (NL) | 2024-11-20 | — | — | EP | disclosed |
| WO-2023135460-A1 | CAPPED POLY(PHENYLENE ETHER) AND CURABLE THERMOSETTING COMPOSITION COMPRISING THE SAME | SHPP GLOBAL TECHNOLOGIES B.V. (NL) | 2023-07-20 | — | — | WO | disclosed |
| WO-2023067442-A1 | LINEAR BLOCK COPOLYMER AND CURABLE THERMOSETTING COMPOSITION COMPRISING THE LINEAR BLOCK COPOLYMER | SHPP GLOBAL TECHNOLOGIES B.V. (NL) | 2023-04-27 | — | — | WO | disclosed |
| WO-2022234455-A1 | CAPPED BISPHENOL POLYINDANE OLIGOMER AND COMPOSITION, METHOD OF MANUFACTURE, AND ARTICLES MADE THEREFROM | SHPP GLOBAL TECHNOLOGIES B.V. (NL) | 2022-11-10 | — | — | WO | disclosed |