Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HRH1 | P35367 | 1/20 | 0.41 |
| ▸ | LTA4H | P09960 | 4/20 | 0.40 |
| ▸ | MAOB | P27338 | 1/20 | 0.38 |
| ▸ | MAOA | P21397 | 1/20 | 0.37 |
| ▸ | RIPK1 | Q13546 | 1/20 | 0.37 |
| ▸ | SLC6A2 | P23975 | 1/20 | 0.37 |
| ▸ | SLC6A4 | P31645 | 1/20 | 0.37 |
| ▸ | MAPK8 | P45983 | 1/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.36 |
| ▸ | GAA | P10253 | 1/20 | 0.36 |
| ▸ | TSHR | P16473 | 1/20 | 0.35 |
| ▸ | BCHE | P06276 | 2/20 | 0.35 |
| ▸ | ACHE | P22303 | 2/20 | 0.35 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.35 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.35 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.35 |
| ▸ | NOS3 | P29474 | 1/20 | 0.35 |
| ▸ | NOS1 | P29475 | 1/20 | 0.35 |
| ▸ | NOS2 | P35228 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29126547 | 0.86 | LTA4H (0.40) | HRH1LTA4HMAOBMAOARIPK1 | |
| SCHEMBL28738376 | 0.86 | BCHE (0.46) | LTA4HBCHEACHE | |
| SCHEMBL6320316 | 0.82 | MAOB (0.42) | HRH1LTA4HMAOBMAOARIPK1 | |
| SCHEMBL1660709 | 0.82 | LTA4H (0.39) | HRH1LTA4HMAOBMAOARIPK1 | |
| SCHEMBL7656175 | 0.81 | HRH1 (0.50) | HRH1LTA4HRIPK1SLC6A2SLC6A4 | |
| SCHEMBL983636 | 0.80 | IAPP (0.41) | LTA4HALDH1A1GAA | |
| SCHEMBL19808529 | 0.80 | LTA4H (0.40) | HRH1LTA4HRIPK1SLC6A2SLC6A4 | |
| SCHEMBL2446750 | 0.80 | MAPT (0.43) | MAOABCHEACHECYP1A2CYP2C9 | |
| SCHEMBL11206775 | 0.79 | CA12 (0.40) | ALDH1A1GAACYP1A2CYP2C9CYP2C19 | |
| SCHEMBL7776603 | 0.78 | LTA4H (0.52) | LTA4HMAOBMAOAALDH1A1GAA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109897180-A | Polyamic acid solution, clear polyimides resin film and transparent substrate using it | 株式会社斗山 | 2019-06-18 | — | — | CN | claimed |
| CN-107810222-A | Polyamidoimide precursor, polyamidoimide film and the display device for including the polyamidoimide film | 可隆工业株式会社 | 2018-03-16 | — | — | CN | claimed |
| CN-103289633-B | Polyimide-based adhesive composition, cured product, adhesive sheet, laminate, and flexible printed circuit board | ARAKAWA CHEM IND | 2015-05-20 | — | — | CN | claimed |
| CN-112939915-B | Diamine monomer for photosensitive resin, polyimide precursor, photosensitive resin composition, and use thereof | 武汉柔显科技股份有限公司 | 2022-10-14 | — | — | CN | disclosed |
| CN-112840747-A | Thermal substrate | 杜邦电子公司 | 2021-05-25 | — | — | CN | disclosed |
| CN-111065516-A | Multilayer films for electronic circuit applications | E.I.内穆尔杜邦公司 | 2020-04-24 | — | — | CN | disclosed |
| CN-110520433-A | Phosphorus-containing phenol compound, phosphorus-containing epoxy resin, curable resin composition or epoxy resin composition thereof, and cured product thereof | NIPPON STEEL & SUMIKIN CHEMICAL COMPANY | 2019-11-29 | — | — | CN | disclosed |
| CN-109897180-A | Polyamic acid solution, clear polyimides resin film and transparent substrate using it | 株式会社斗山 | 2019-06-18 | — | — | CN | disclosed |
| CN-104379626-B | Phosphorus-containing epoxy resin, composition containing the epoxy resin as essential component, and cured product | 日铁化学材料株式会社 | 2019-03-22 | — | — | CN | disclosed |
| CN-109293881-A | Phosphorous epoxy resin and using the epoxy resin as the composition of essential component, solidfied material | 新日铁住金化学株式会社 | 2019-02-01 | — | — | CN | disclosed |
| CN-105531652-B | Touch screen, radiation-sensitive resin composition and cured film | JSR株式会社 | 2018-12-21 | — | — | CN | disclosed |
| CN-104379626-A | Phosphorus-containing epoxy resin, composition containing the epoxy resin as essential component, and cured product | NIPPON STEEL & SUMIKIN CHEM CO | 2015-02-25 | — | — | CN | disclosed |
| EP-2178952-A1 | POLYIMIDE FILM WITH IMPROVED THERMAL STABILITY | Kolon Industries Inc. (KR) | 2010-04-28 | — | — | EP | disclosed |
| WO-2009017330-A1 | POLYIMIDE FILM WITH IMPROVED THERMAL STABILITY | KOLON INDUSTRIES, INC. (KR) | 2009-02-05 | — | — | WO | disclosed |
| WO-2009007809-A1 | PRIMER COMPOSITION | BASF COATINGS JAPAN LTD. (DE) | 2009-01-15 | — | — | WO | disclosed |
| EP-1193280-B1 | POLYIMIDE RESIN COMPOSITION WITH IMPROVED MOISTURE RESISTANCE, ADHESIVE SOLUTION, FILMY BONDING MEMBER, LAYERED ADHESIVE FILM, AND PROCESSES FOR PRODUCING THESE | KANEKA CORP (JP) | 2004-11-24 | — | — | EP | disclosed |
| WO-2004086146-A1 | TRANSPARENT, HIGHLY HEAT-RESISTANT POLYIMIDE PRECURSOR AND PHOTOSENSITIVE POLYIMIDE COMPOSITION THEREOF | LG CHEM LTD (KR) | 2004-10-07 | — | — | WO | disclosed |
| US-6693162-B2 | OBTAINED BY REACTION OF TETRACARBOXYLIC ACID ANHYDRIDE CONTAINING ESTER GROUPS WITH AN AROMATIC AMINE; COATINGS FOR SUPERCONDUCTIVE WIRE | KANEKA JAPAN CORPORATION (JP) | 2004-02-17 | — | — | US | disclosed |
| US-20030045669-A1 | Polyimide resin and resin composition, adhesive solution, film-state joining component,and adhesive laminate film improved in moisture resistance using it,and production methods therefor | KANEKA CORPORATION (JP) | 2003-03-06 | — | — | US | disclosed |
| EP-1193280-A1 | POLYIMIDE RESIN, RESIN COMPOSITION WITH IMPROVED MOISTURE RESISTANCE COMPRISING THE SAME, ADHESIVE SOLUTION, FILMY BONDING MEMBER, LAYERED ADHESIVE FILM, AND PROCESSES FOR PRODUCING THESE | Kaneka Corporation (JP) | 2002-04-03 | — | — | EP | disclosed |