SCHEMBL27678151

SCHEMBL27678151

CCC=C(O)C1COC(C=O)O1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8634384 0.74 SUCNR1 (0.35)
SCHEMBL27881920 0.71
SCHEMBL2216626 0.70
SCHEMBL27650605 0.67
SCHEMBL27889209 0.65 ALDH1A1 (0.30)
SCHEMBL2217198 0.63 ALDH1A1 (0.38)
SCHEMBL19264266 0.63 NOS2 (0.41)
SCHEMBL2217441 0.62
SCHEMBL27278259 0.62
SCHEMBL27512913 0.62

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-1808273-B Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel SAMSUNG ELECTRONICS CO LTD 2012-12-26 CN disclosed
CN-100351309-C Underlayer coating forming composition for lithography containing compound having protected carboxyl group NISSAN CHEMICAL IND LTD (JP) 2007-11-28 CN disclosed
CN-1830202-A Composition for forming lower layer film for lithography comprising compound having protected carboxyl group NISSAN CHEMICAL IND LTD (JP) 2006-09-06 CN disclosed
CN-1808273-A Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel SAMSUNG ELECTRONICS CO LTD (KR) 2006-07-26 CN disclosed