⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10589108 | 0.86 | — | — | |
| SCHEMBL10589783 | 0.82 | — | — | |
| SCHEMBL2476120 | 0.79 | GSK3A (0.33) | — | |
| SCHEMBL8433146 | 0.79 | GSK3A (0.33) | — | |
| SCHEMBL9230111 | 0.67 | GSK3A (0.31) | — | |
| SCHEMBL9842155 | 0.66 | ESR2 (0.43) | — | |
| SCHEMBL3881256 | 0.66 | — | — | |
| SCHEMBL2355854 | 0.65 | CYP1A2 (0.40) | — | |
| SCHEMBL1723568 | 0.64 | — | — | |
| SCHEMBL9719969 | 0.63 | DAO (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20220169819-A1 | RESIN COMPOSITION FOR PRODUCTION OF FOAM PARTICLES, FOAM PARTICLES, FOAM MOLDED BODY AND COMPOSITE STRUCTURE MEMBER | SEKISUI PLASTICS CO., LTD. (JP) | 2022-06-02 | — | — | US | disclosed |
| EP-3677624-B1 | BEAD FOAM, RESIN COMPOSITE PROVIDED WITH SAME, AND METHOD FOR PRODUCING BEAD FOAM | SEKISUI KASEI CO LTD (JP) | 2022-05-18 | — | — | EP | disclosed |
| EP-3950792-A1 | RESIN COMPOSITION FOR PRODUCTION OF FOAM PARTICLES, FOAM PARTICLES, FOAM MOLDED BODY AND COMPOSITE STRUCTURE MEMBER | SEKISUI PLASTICS CO., LTD. (JP) | 2022-02-09 | — | — | EP | disclosed |
| US-20220010089-A1 | EXPANDED PARTICLES AND EXPANDED MOLDED ARTICLE | SEKISUI KASEI CO., LTD. (JP) | 2022-01-13 | — | — | US | disclosed |
| EP-3858906-A1 | EXPANDED PARTICLES AND EXPANDED MOLDED ARTICLE | Sekisui Kasei Co., Ltd. (JP) | 2021-08-04 | — | — | EP | disclosed |
| US-10988594-B2 | Polycarbonate-based resin foam particle and foam molded body | SEKISUI PLASTICS CO., LTD. (JP) | 2021-04-27 | — | — | US | disclosed |
| EP-3677624-A1 | BEAD FOAM, RESIN COMPOSITE PROVIDED WITH SAME, AND METHOD FOR PRODUCING BEAD FOAM | Sekisui Plastics Co., Ltd. (JP) | 2020-07-08 | — | — | EP | disclosed |
| US-20200123339-A1 | BEAD FOAM, RESIN COMPOSITE PROVIDED WITH SAME, AND METHOD FOR PRODUCING BEAD FOAM | SEKISUI PLASTICS CO., LTD. (JP) | 2020-04-23 | — | — | US | disclosed |
| US-20190248978-A1 | POLYCARBONATE-BASED RESIN FOAM PARTICLE AND FOAM MOLDED BODY | SEKISUI PLASTICS CO., LTD. (JP) | 2019-08-15 | — | — | US | disclosed |
| EP-3511370-A1 | POLYCARBONATE-BASED RESIN FOAM PARTICLE AND FOAM MOLDED BODY | Sekisui Plastics Co., Ltd. (JP) | 2019-07-17 | — | — | EP | disclosed |
| EP-1090744-A2 | Composite sheet having foamed polycarbonate resin layer and non-foamed polycarbonate resin layer | JSP CORPORATION (JP) | 2001-04-11 | — | — | EP | disclosed |
| US-6191178-B1 | AS SHOCK ABSORBER FOR VEHICLES | JSP CORPORATION (JP) | 2001-02-20 | — | — | US | disclosed |
| EP-1055701-A1 | POLYCARBONATE RESIN FOAM AND SHOCK ABSORBER USING THE SAME | JSP CORPORATION (JP) | 2000-11-29 | — | — | EP | disclosed |
| US-6136444-A | Transparent conductive sheet | TEIJIN LIMITED (JP) | 2000-10-24 | — | — | US | disclosed |
| US-5854294-A | Process for producing foamed body of polycarbonate resin and foamed body obtained thereby | JSP CORPORATION (JP) | 1998-12-29 | — | — | US | disclosed |
| EP-0785057-A2 | Process for producing foamed body of polycarbonate resin and foamed body obtained thereby | JSP CORPORATION (JP) | 1997-07-23 | — | — | EP | disclosed |
| EP-0726579-A2 | Transparent conductive sheet | TEIJIN LIMITED (JP) | 1996-08-14 | — | — | EP | disclosed |
| EP-0147747-B1 | HEAT-TRANSFER IMAGE-RECEIVING ELEMENT | KONICA CORPORATION (JP) | 1990-06-06 | — | — | EP | disclosed |
| US-4840870-A | DISCOLORATION INHIBITION | KONISHIROKU PHOTO INDUSTRY CO., LTD. (JP) | 1989-06-20 | — | — | US | disclosed |
| EP-0147747-A2 | Heat-transfer image-receiving element | KONICA CORPORATION (JP) | 1985-07-10 | — | — | EP | disclosed |