SCHEMBL27730754

SCHEMBL27730754

CCO[Si](C)(OCC)OC(C)C1COC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27710290 0.81
SCHEMBL27894754 0.81
SCHEMBL2727612 0.81 SHBG (0.39)
SCHEMBL28337141 0.80
SCHEMBL439734 0.79 LMNA (0.30)
SCHEMBL29101310 0.75
SCHEMBL7877700 0.74 LMNA (0.30)
SCHEMBL28334802 0.73
SCHEMBL13890102 0.70
SCHEMBL28334793 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116648353-B Resin coated ultra-thin plate glass and display device 东丽株式会社 2025-01-21 CN disclosed
CN-118679429-A Positive photosensitive resin composition, cured product thereof, and display device comprising same 东丽株式会社 2024-09-20 CN disclosed
CN-110573964-B Negative photosensitive resin composition and cured film 东丽株式会社 2023-11-03 CN disclosed
CN-116648353-A Resin coated ultra-thin plate glass 东丽株式会社 2023-08-25 CN disclosed
CN-110573964-A Negative photosensitive resin composition and cured film 东丽株式会社 2019-12-13 CN disclosed
CN-104204945-A Photosensitive black resin composition and resin black matrix substrate TORAY INDUSTRIES 2014-12-10 CN disclosed
CN-101515113-A Radioactive ray sensibility resin composition, interlayer insulating film, microlens and method of forming the same JSR CORP (JP) 2009-08-26 CN disclosed
CN-101226329-A Radiation sensitive resin composition, laminated insulating film, micro lens and preparation method thereof JSR CORP (JP) 2008-07-23 CN disclosed